Invention Application
US20160064257A1 SUBSTRATE LIQUID PROCESSING METHOD AND SUBSTRATE LIQUID PROCESSING APPARATUS
审中-公开
基板液体加工方法和底材液体加工装置
- Patent Title: SUBSTRATE LIQUID PROCESSING METHOD AND SUBSTRATE LIQUID PROCESSING APPARATUS
- Patent Title (中): 基板液体加工方法和底材液体加工装置
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Application No.: US14828579Application Date: 2015-08-18
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Publication No.: US20160064257A1Publication Date: 2016-03-03
- Inventor: Jun Nonaka , Itaru Kanno
- Applicant: Tokyo Electron Limited
- Priority: JP2014-171733 20140826; JP2015-138964 20150710
- Main IPC: H01L21/67
- IPC: H01L21/67
Abstract:
Disclosed is a substrate liquid processing method. The method includes producing a processing liquid including deionized water, carbon dioxide, and ammonia, which has a PH of a predetermined value in a range of pH 5 to 9; and processing a substrate having a metal exposed, using the processing liquid.
Public/Granted literature
- US10242889B2 Substrate liquid processing method and substrate liquid processing apparatus Public/Granted day:2019-03-26
Information query
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