Invention Application
- Patent Title: SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
- Patent Title (中): 基板处理装置和基板处理方法
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Application No.: US14781077Application Date: 2014-03-25
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Publication No.: US20160071746A1Publication Date: 2016-03-10
- Inventor: Konosuke HAYASHI
- Applicant: SHIBAURA MECHATRONICS CORPORATION
- Applicant Address: JP Yokohama-shi
- Assignee: Shibaura Mechatronics Corporation
- Current Assignee: Shibaura Mechatronics Corporation
- Current Assignee Address: JP Yokohama-shi
- Priority: JP2013-073877 20130329; JP2014-060462 20140324
- International Application: PCT/JP14/58241 WO 20140325
- Main IPC: H01L21/67
- IPC: H01L21/67 ; B08B3/10 ; H01L21/306 ; H01L21/02 ; H01L21/687 ; H01L21/66
Abstract:
According to one embodiment, a substrate processing apparatus (1) includes: a support (4) configured to support a substrate (W) in a plane; a rotation mechanism (5) configured to rotate the support (4) about an axis that crosses a surface of the substrate (W) supported by the support (4) as a rotation axis; a plurality of nozzles (6a, 6b, 6c), which are aligned from the center toward the periphery of the substrate (W) supported by the support (4), configured to eject a treatment liquid to the surface of the substrate (W) on the support (4) being rotated by the rotation mechanism (5), and a controller (9) configured to control the nozzles to eject the treatment liquid at different ejection timings according to the thickness of a film of the treatment liquid formed on the surface of the substrate (W) on the support (4) being rotated by the rotation mechanism (5).
Public/Granted literature
- US10325787B2 Substrate processing apparatus and substrate processing method Public/Granted day:2019-06-18
Information query
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