Invention Application
- Patent Title: Method for Manufacturing a Composite Wafer having a Graphite Core, and Composite Wafer having a Graphite Core
- Patent Title (中): 具有石墨芯的复合晶片的制造方法和具有石墨芯的复合晶片
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Application No.: US14962393Application Date: 2015-12-08
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Publication No.: US20160086844A1Publication Date: 2016-03-24
- Inventor: Rudolf Berger , Hermann Gruber , Wolfgang Lehnert , Guenther Ruhl , Raimund Foerg , Anton Mauder , Hans-Joachim Schulze , Karsten Kellermann , Michael Sommer , Christian Rottmair , Roland Rupp
- Applicant: Infineon Technologies AG
- Main IPC: H01L21/762
- IPC: H01L21/762 ; H01L21/321 ; H01L21/265 ; H01L29/20 ; H01L21/324 ; H01L21/02 ; H01L29/16
Abstract:
A composite wafer is manufactured by providing a carrier wafer including graphite and a protective layer, forming a bonding layer, and bonding the carrier wafer to a semiconductor wafer through the bonding layer.
Public/Granted literature
Information query
IPC分类:
