Invention Application
- Patent Title: HIGH SPEED SURFACE PLASMON COUPLED LIGHT EMITTING DIODES
- Patent Title (中): 高速表面等离子体偶联发光二极管
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Application No.: US14787122Application Date: 2014-04-28
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Publication No.: US20160087143A1Publication Date: 2016-03-24
- Inventor: Ee Jin Teo , Jinghua Teng , Chengyuan Yang , Andrew Bettiol
- Applicant: AGENCY FOR SCIENCE, TECHNOLOGY AND RESEARCH , NATIONAL UNIVERSITY OF SINGAPORE
- Priority: SG201303250-3 20130426
- International Application: PCT/SG2014/000190 WO 20140428
- Main IPC: H01L33/06
- IPC: H01L33/06 ; H01L33/32 ; H01L33/50 ; H01L33/00

Abstract:
A light emitting diode device (LED) is provided. The LED comprises a first-doped layer on a substrate, an active layer on the first-doped layer, a second-doped layer on the active layer, and a metal layer on the second-doped layer. The second-doped layer is patterned on a surface opposite to the active layer to define a first portion and a second portion. The first portion of the second-doped layer has a first portion thickness constrained for electron-hole pairs in the active layer to couple efficiently to a surface plasmon mode at an interface of the metal layer and the second-doped layer thereby increasing the spontaneous emission rate of the LED. The second portion of the second-doped layer has a second portion thickness sufficient to ensure formation of a p-n junction in the LED.
Public/Granted literature
- US09768347B2 High speed surface plasmon coupled light emitting diodes Public/Granted day:2017-09-19
Information query
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