Invention Application
- Patent Title: DEVICES AND METHODS TO REDUCE STRESS IN AN ELECTRONIC DEVICE
- Patent Title (中): 降低电子设备中应力的装置和方法
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Application No.: US14498230Application Date: 2014-09-26
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Publication No.: US20160095208A1Publication Date: 2016-03-31
- Inventor: Daeik Daniel Kim , Je-Hsiung Jeffrey Lan , Changhan Hobie Yun , Mario Francisco Velez , Chengjie Zuo , Jonghae Kim , David Francis Berdy
- Applicant: QUALCOMM Incorporated
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H01L21/768 ; H05K1/09 ; C23F1/02 ; H05K1/03
Abstract:
A device includes a stress relief region between at least two stress domains of a substrate (e.g., of a semiconductor die or other integrated circuit). The stress relief region includes a conductive structure electrically coupling circuitries of the stress domains between which the conductive structure is disposed.
Public/Granted literature
- US09560745B2 Devices and methods to reduce stress in an electronic device Public/Granted day:2017-01-31
Information query
