Invention Application
- Patent Title: POLYIMIDE RESIN AND POLYIMIDE FILM PRODUCED THEREFROM
- Patent Title (中): 聚酰胺树脂和聚酰亚胺膜生产
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Application No.: US14388488Application Date: 2013-05-20
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Publication No.: US20160096952A1Publication Date: 2016-04-07
- Inventor: Hyo Jun PARK , Hak Gee JUNG , Chul Ha JU
- Applicant: KOLON INDUSTRIES, INC.
- Applicant Address: KR Gwacheon-si, Gyeonggi-do
- Assignee: KOLON INDUSTRIES, INC.
- Current Assignee: KOLON INDUSTRIES, INC.
- Current Assignee Address: KR Gwacheon-si, Gyeonggi-do
- International Application: PCT/KR13/04394 WO 20130520
- Main IPC: C08K9/06
- IPC: C08K9/06 ; C08J5/18
Abstract:
Disclosed herein is a polyimide resin including a silica filler surface-treated with a fluorine-containing compound, and a polyimide film formed using the polyimide resin. The polyimide resin has improved dispersibility and heat resistance because the surface of a silica filler is fluorinated.
Information query
