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公开(公告)号：US20160319076A1
公开(公告)日：2016-11-03
申请号：US15107634
申请日：2014-12-26
Applicant: KOLON INDUSTRIES, INC.
Inventor： Chul Ha JU , Hyo Jun PARK , Hak Gee JUNG
CPC classification number: C08G73/14 , C08G73/1003 , C08J5/18 , C08J2379/08 , C08L79/08
Abstract: Disclosed are a transparent polyamide-imide resin and a film using the same, which can be colorless and transparent, can show excellent thermal stability and mechanical properties, and can have low birefringence, making it possible to serve in various fields including a semiconductor insulator, a TFT-LCD insulator, a passivation layer, a liquid crystal alignment layer, materials for optical communication, a protective film for a solar cell, a flexible display substrate and the like.
Abstract translation: 公开了一种透明的聚酰胺酰亚胺树脂和使用该透明聚酰胺酰亚胺树脂的薄膜，其可以是无色透明的，可以显示出优异的热稳定性和机械性能，并且可以具有低双折射，使其可以用于各种领域，包括半导体绝缘体， TFT-LCD绝缘体，钝化层，液晶取向层，光通信用材料，太阳能电池用保护膜，柔性显示基板等。
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公开(公告)号：US20180186936A1
公开(公告)日：2018-07-05
申请号：US15739359
申请日：2016-06-27
Applicant: KOLON INDUSTRIES, INC.
Inventor： Chul Ha JU , Hak Gee JUNG , Hyo Jun PARK
CPC classification number: C08G73/14 , C08G73/1039 , C08G73/1042 , C08G73/1067 , C08J5/18 , C08J2379/08 , C09D179/08
Abstract: Disclosed is a polyamide-imide precursor having a molecular structure in which a first polymer, derived from polymerization of a dianhydride and a diamine, and a second polymer, derived from polymerization of a diamine and an aromatic dicarbonyl compound, are copolymerized, wherein the diamine includes 3 to 50 mol % of at least one of 9,9-bis(4-aminophenyl)fluorene (FDA) and 9,9-bis(4-amino-3-fluorophenyl)fluorene (F-FDA), based on the total molar amount of the diamine. Also, a copolymerized polyamide-imide in which the polyamide-imide precursor is imidized or a copolymerized polyamide-imide film formed by an imidization reaction of the polyamide-imide precursor and an image display device including the copolymerized polyamide-imide film are provided.
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公开(公告)号：US20180134848A1
公开(公告)日：2018-05-17
申请号：US15569825
申请日：2015-04-28
Applicant: KOLON INDUSTRIES, INC.
Inventor： Chul Ha JU , Hak Gee JUNG , Hyo Jun PARK
CPC classification number: C08G73/1071 , B29C41/003 , B29C41/46 , B29C71/02 , B29K2079/08 , B29L2007/008 , C08G73/1039 , C08G73/1042 , C08G73/1064 , C08J5/18 , C08J2379/08 , C08L79/08
Abstract: This invention relates to a polyimide resin and a film using the same, wherein the polyimide resin is an imidized product of polyamic acid in which a polymerization composition including a diamine-based monomer and a dianhydride-based monomer is copolymerized, at least one of the diamine-based monomer and the dianhydride-based monomer including a monomer containing at least one selected from among an oxy group, a sulfone group and a fluoro group, the diamine-based monomer including at least one selected from among 1,3-bis(4-aminophenoxy)benzene and 2,2-bis[4-(4-aminophenoxy)phenyl]hexafluoropropane, and thus the polyimide resin has improved heat resistance and mechanical properties while being colorless and transparent and can thus be efficiently applied to a variety of fields, including semiconductor insulation layers, TFT-LCD insulation layers, passivation layers, liquid crystal alignment layers, optical communication materials, protective layers for solar cells, and flexible display substrates.
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公开(公告)号：US20160096952A1
公开(公告)日：2016-04-07
申请号：US14388488
申请日：2013-05-20
Applicant: KOLON INDUSTRIES, INC.
Inventor： Hyo Jun PARK , Hak Gee JUNG , Chul Ha JU
CPC classification number: C08K9/06 , C08G73/1014 , C08G73/1039 , C08G73/1042 , C08G73/1067 , C08G73/1075 , C08J5/18 , C08J2379/08 , C08L79/08 , C09D179/08
Abstract: Disclosed herein is a polyimide resin including a silica filler surface-treated with a fluorine-containing compound, and a polyimide film formed using the polyimide resin. The polyimide resin has improved dispersibility and heat resistance because the surface of a silica filler is fluorinated.
Abstract translation: 本文公开了包含用含氟化合物表面处理的二氧化硅填料的聚酰亚胺树脂和使用该聚酰亚胺树脂形成的聚酰亚胺膜。 由于二氧化硅填料的表面被氟化，聚酰亚胺树脂具有改善的分散性和耐热性。
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