HIGH HEAT-RESISTANT POLYAMIC ACID SOLUTION AND POLYIMIDE FILM

    公开(公告)号:US20170233575A1

    公开(公告)日:2017-08-17

    申请号:US15322957

    申请日:2015-06-30

    Abstract: This invention relates to a highly heat-resistant polyamic acid solution and a polyimide film having improved thermal dimensional stability, wherein the polyamic acid solution includes a polymer of a diamine compound, containing 1 to 10 mol % of a carboxylic acid functional group-containing diamine compound based on the total amount of diamine, and a dianhydride compound, and the polyimide film includes polyimide, which is an imidized product of the polyamic acid solution and is configured such that main chains thereof are crosslinked through an amide bond (—CONH—).

    TRANSPARENT POLYAMIDE-IMIDE RESIN AND FILM USING SAME
    3.
    发明申请
    TRANSPARENT POLYAMIDE-IMIDE RESIN AND FILM USING SAME 有权
    透明聚酰胺 - 酰亚胺树脂和薄膜

    公开(公告)号:US20160319076A1

    公开(公告)日:2016-11-03

    申请号:US15107634

    申请日:2014-12-26

    CPC classification number: C08G73/14 C08G73/1003 C08J5/18 C08J2379/08 C08L79/08

    Abstract: Disclosed are a transparent polyamide-imide resin and a film using the same, which can be colorless and transparent, can show excellent thermal stability and mechanical properties, and can have low birefringence, making it possible to serve in various fields including a semiconductor insulator, a TFT-LCD insulator, a passivation layer, a liquid crystal alignment layer, materials for optical communication, a protective film for a solar cell, a flexible display substrate and the like.

    Abstract translation: 公开了一种透明的聚酰胺酰亚胺树脂和使用该透明聚酰胺酰亚胺树脂的薄膜,其可以是无色透明的,可以显示出优异的热稳定性和机械性能,并且可以具有低双折射,使其可以用于各种领域,包括半导体绝缘体, TFT-LCD绝缘体,钝化层,液晶取向层,光通信用材料,太阳能电池用保护膜,柔性显示基板等。

    POLYIMIDE RESIN AND FILM USING SAME
    9.
    发明申请

    公开(公告)号:US20180134848A1

    公开(公告)日:2018-05-17

    申请号:US15569825

    申请日:2015-04-28

    Abstract: This invention relates to a polyimide resin and a film using the same, wherein the polyimide resin is an imidized product of polyamic acid in which a polymerization composition including a diamine-based monomer and a dianhydride-based monomer is copolymerized, at least one of the diamine-based monomer and the dianhydride-based monomer including a monomer containing at least one selected from among an oxy group, a sulfone group and a fluoro group, the diamine-based monomer including at least one selected from among 1,3-bis(4-aminophenoxy)benzene and 2,2-bis[4-(4-aminophenoxy)phenyl]hexafluoropropane, and thus the polyimide resin has improved heat resistance and mechanical properties while being colorless and transparent and can thus be efficiently applied to a variety of fields, including semiconductor insulation layers, TFT-LCD insulation layers, passivation layers, liquid crystal alignment layers, optical communication materials, protective layers for solar cells, and flexible display substrates.

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