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公开(公告)号：US20160319076A1
公开(公告)日：2016-11-03
申请号：US15107634
申请日：2014-12-26
Applicant: KOLON INDUSTRIES, INC.
Inventor： Chul Ha JU , Hyo Jun PARK , Hak Gee JUNG
CPC classification number: C08G73/14 , C08G73/1003 , C08J5/18 , C08J2379/08 , C08L79/08
Abstract: Disclosed are a transparent polyamide-imide resin and a film using the same, which can be colorless and transparent, can show excellent thermal stability and mechanical properties, and can have low birefringence, making it possible to serve in various fields including a semiconductor insulator, a TFT-LCD insulator, a passivation layer, a liquid crystal alignment layer, materials for optical communication, a protective film for a solar cell, a flexible display substrate and the like.
Abstract translation: 公开了一种透明的聚酰胺酰亚胺树脂和使用该透明聚酰胺酰亚胺树脂的薄膜，其可以是无色透明的，可以显示出优异的热稳定性和机械性能，并且可以具有低双折射，使其可以用于各种领域，包括半导体绝缘体， TFT-LCD绝缘体，钝化层，液晶取向层，光通信用材料，太阳能电池用保护膜，柔性显示基板等。
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公开(公告)号：US20160040027A1
公开(公告)日：2016-02-11
申请号：US14781829
申请日：2014-03-31
Applicant: KOLON INDUSTRIES, INC.
Inventor： Hak Yong WOO , Hak Gee JUNG , Ki ll HONG
IPC: C09D133/14
CPC classification number: C09D133/14 , B32B5/024 , B32B9/005 , B32B9/047 , B32B27/20 , B32B2262/101 , B32B2457/20 , B32B2457/206
Abstract: Disclosed is a polyimide cover substrate, which is configured such that a device protection layer is formed of a urethane acrylate compound on at least one side of a polyimide film, thereby exhibiting not only high flexural properties and impact resistance but also superior solvent resistance, optical properties and scratch resistance and low water vapor transmission rate, and thus can be effectively utilized as a cover substrate for a flexible electronic device.
Abstract translation: 公开了一种聚酰亚胺覆盖基板，其被构造为使得在聚酰亚胺膜的至少一侧上由氨基甲酸酯丙烯酸酯化合物形成器件保护层，从而不仅表现出高的抗弯曲性和耐冲击性，而且具有优异的耐溶剂性，光学性 性能和耐擦伤性以及低水蒸汽透过率，因此可以有效地用作柔性电子器件的覆盖基片。
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3.发明申请公开(公告)号：US20180194900A1
公开(公告)日：2018-07-12
申请号：US15740982
申请日：2016-06-29
Applicant: KOLON INDUSTRIES, INC.
Inventor： Doo Li CHOI , Hak Gee JUNG
CPC classification number: C08G73/22 , C08G61/122 , C08G73/1039 , C08G73/1042 , C08G73/1057 , C08G73/1067 , C08G73/1071 , C08J5/18 , C08J2379/04 , C08J2379/08 , C08L79/08 , C08L2201/10 , C08L2203/16
Abstract: This invention relates to a polyimide-polybenzoxazole precursor solution, a polyimide-polybenzoxazole film, and a method of manufacturing the same, wherein a film manufactured using the polyimide-polybenzoxazole precursor solution of the invention is formed by copolymerizing a unit structure of diamine and dianhydride and a unit structure of diaminophenol and dicarbonyl chloride in an organic solvent, and is colorless and transparent, like conventional polyimide films, and can exhibit improved heat resistance and low birefringence.
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4.发明申请公开(公告)号：US20180010012A1
公开(公告)日：2018-01-11
申请号：US15540874
申请日：2015-12-31
Applicant: KOLON INDUSTRIES, INC.
Inventor： Sang Hyun AHN , Hak Yong WOO , Hak Gee JUNG , Dong Hee LEE , Byung Joon AN , Hang Geun KIM
IPC: C09D185/00 , G02B1/04
CPC classification number: C09D185/00 , C08G65/22 , C08G77/58 , C08J7/047 , C08J2367/02 , C08J2483/06 , C09D4/06 , C09D133/00 , C09D183/14 , G02B1/04 , C08F283/12
Abstract: This invention relates to a resin composition for a hard coating, including a siloxane resin configured such that compounds including an alkoxysilane and an alkoxy metal compound are chemically bound, and to a hard coating film including a hard coating layer formed using the resin composition.
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公开(公告)号：US20180002487A1
公开(公告)日：2018-01-04
申请号：US15540803
申请日：2015-12-31
Applicant: KOLON INDUSTRIES, INC.
Inventor： Jong Won YANG , Hak Gee JUNG
CPC classification number: C08G73/14 , C08G73/1028 , C08G73/1039 , C08G73/1042 , C08G73/1067 , C08G81/00 , C08J5/18 , C08J2379/08
Abstract: The present invention relates to a polyamide-imide precursor, a polyamide-imide obtained by imidizing the same, a polyamide-imide film, and an image display device including the film. The polyamide-imide precursor includes, in a molecular structure thereof, a first block, obtained by copolymerizing monomers including dianhydride and diamine, a second block, obtained by copolymerizing monomers including an aromatic dicarbonyl compound and the diamine, and a third block, obtained by copolymerizing monomers including the aromatic dicarbonyl compound and aromatic diamine. The dianhydride for forming the first block includes 2-bis(3,4-dicarboxyphenyl)hexafluoropropane dianhydride (6FDA), and the diamine for forming the first block and the second block includes 9,9-bis(3-fluoro-4-aminophenyl)fluorene (FFDA).
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Patent Agency Ranking
公开(公告)号：US20170233575A1
公开(公告)日：2017-08-17
申请号：US15322957
申请日：2015-06-30
Applicant: KOLON INDUSTRIES, INC.
Inventor： Woong Ki MIN , Hyo Jun PARK , Hak Gee JUNG , Ki Il HONG
Abstract: This invention relates to a highly heat-resistant polyamic acid solution and a polyimide film having improved thermal dimensional stability, wherein the polyamic acid solution includes a polymer of a diamine compound, containing 1 to 10 mol % of a carboxylic acid functional group-containing diamine compound based on the total amount of diamine, and a dianhydride compound, and the polyimide film includes polyimide, which is an imidized product of the polyamic acid solution and is configured such that main chains thereof are crosslinked through an amide bond (—CONH—).
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公开(公告)号：US20180134848A1
公开(公告)日：2018-05-17
申请号：US15569825
申请日：2015-04-28
Applicant: KOLON INDUSTRIES, INC.
Inventor： Chul Ha JU , Hak Gee JUNG , Hyo Jun PARK
CPC classification number: C08G73/1071 , B29C41/003 , B29C41/46 , B29C71/02 , B29K2079/08 , B29L2007/008 , C08G73/1039 , C08G73/1042 , C08G73/1064 , C08J5/18 , C08J2379/08 , C08L79/08
Abstract: This invention relates to a polyimide resin and a film using the same, wherein the polyimide resin is an imidized product of polyamic acid in which a polymerization composition including a diamine-based monomer and a dianhydride-based monomer is copolymerized, at least one of the diamine-based monomer and the dianhydride-based monomer including a monomer containing at least one selected from among an oxy group, a sulfone group and a fluoro group, the diamine-based monomer including at least one selected from among 1,3-bis(4-aminophenoxy)benzene and 2,2-bis[4-(4-aminophenoxy)phenyl]hexafluoropropane, and thus the polyimide resin has improved heat resistance and mechanical properties while being colorless and transparent and can thus be efficiently applied to a variety of fields, including semiconductor insulation layers, TFT-LCD insulation layers, passivation layers, liquid crystal alignment layers, optical communication materials, protective layers for solar cells, and flexible display substrates.
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公开(公告)号：US20170335062A1
公开(公告)日：2017-11-23
申请号：US15021367
申请日：2016-02-11
Applicant: KOLON INDUSTRIES, INC.
Inventor： Jong Won YANG , Hak Gee JUNG
CPC classification number: C08G73/1067 , C08G73/1039 , C08G73/1042 , C08J5/18 , C08J2379/08 , C08L79/08
Abstract: Disclosed is a polyamic acid, which is a polymerized product of a diamine and a dianhydride, wherein the diamine includes 9,9-bis(3-fluoro-4-aminophenyl)fluorene (FFDA), and the dianhydride includes 2-bis(3,4-dicarboxyphenyl)hexafluoropropane dianhydride (6FDA) and 3,3′,4,4′-biphenyltetracarboxylic dianhydride (BPDA). Also, a polyamide resin and a polyimide film, which are imidized products of the polyamic acid, are provided.
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公开(公告)号：US20160369054A1
公开(公告)日：2016-12-22
申请号：US15114093
申请日：2015-01-26
Applicant: KOLON INDUSTRIES, INC.
Inventor： Hyo Jun PARK , Hak Gee JUNG , Chang Sik HA , Pradip Kumar TAPASWI , Young Sik JEONG
CPC classification number: C08G73/1067 , C08G73/0633 , C08G73/10 , C08G73/1042 , C08G73/1075 , C08G73/1078 , C08G73/1085 , C08J5/18 , C08J2379/08 , C08L79/04 , C08L79/08 , C09D179/08
Abstract: This invention relates to a polyimide and a film using the same and, more particularly, to a polyimide, which can exhibit a low dielectric constant while retaining the superior properties thereof, and can thus be utilized as electronic materials such as protective materials or insulating materials for liquid crystal displays or semiconductors, and optical communication materials such as optical waveguide materials, and to a polyimide film including the same.
Abstract translation: 本发明涉及一种聚酰亚胺和使用该聚酰亚胺的膜，更具体地说，涉及一种可以表现出低介电常数同时保持其优异性能的聚酰亚胺，因此可用作电子材料如保护材料或绝缘材料 用于液晶显示器或半导体，以及诸如光波导材料的光学通信材料，以及包括该光学波导材料的聚酰亚胺膜。
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公开(公告)号：US20160096952A1
公开(公告)日：2016-04-07
申请号：US14388488
申请日：2013-05-20
Applicant: KOLON INDUSTRIES, INC.
Inventor： Hyo Jun PARK , Hak Gee JUNG , Chul Ha JU
CPC classification number: C08K9/06 , C08G73/1014 , C08G73/1039 , C08G73/1042 , C08G73/1067 , C08G73/1075 , C08J5/18 , C08J2379/08 , C08L79/08 , C09D179/08
Abstract: Disclosed herein is a polyimide resin including a silica filler surface-treated with a fluorine-containing compound, and a polyimide film formed using the polyimide resin. The polyimide resin has improved dispersibility and heat resistance because the surface of a silica filler is fluorinated.
Abstract translation: 本文公开了包含用含氟化合物表面处理的二氧化硅填料的聚酰亚胺树脂和使用该聚酰亚胺树脂形成的聚酰亚胺膜。 由于二氧化硅填料的表面被氟化，聚酰亚胺树脂具有改善的分散性和耐热性。
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