Invention Application
US20160102396A1 PHYSICAL VAPOR DEPOSITION APPARATUS AND METHOD OF DEPOSITING PHASE-CHANGE MATERIALS USING THE SAME
审中-公开
物理蒸气沉积装置及使用相变材料沉积相变材料的方法
- Patent Title: PHYSICAL VAPOR DEPOSITION APPARATUS AND METHOD OF DEPOSITING PHASE-CHANGE MATERIALS USING THE SAME
- Patent Title (中): 物理蒸气沉积装置及使用相变材料沉积相变材料的方法
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Application No.: US14876183Application Date: 2015-10-06
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Publication No.: US20160102396A1Publication Date: 2016-04-14
- Inventor: Zhe Wu , Jung-Hwan Park , Jeong-Hee Park , Dong-Ho Ahn
- Applicant: Samsung Electronics Co., Ltd.
- Priority: KR10-2014-0136652 20141010
- Main IPC: C23C14/54
- IPC: C23C14/54 ; C23C14/14 ; C23C14/50 ; C23C14/22

Abstract:
A physical vapor deposition (PVD) apparatus for forming a phase-changeable layer includes a process chamber including a loading chamber configured to load a substrate, and a depositing chamber configured to deposit ion particles of a phase-changeable material onto the substrate; a target member on an upper portion of the depositing chamber and configured to provide the ion particles of the phase-changeable material which react with process gases in a plasma state; a plasma generator configured to generate a process gas plasma from the process gases; a chuck on a lower portion of the depositing chamber and holding the substrate, the chuck including a heater configured to heat the substrate, and at least one electrode configured to guide the ion particles of the phase-changeable material to the substrate; and a supplementary heater in the process chamber and configured to transfer radiant heat around the substrate.
Information query
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