Invention Application
- Patent Title: MERGED FIN STRUCTURES FOR FINFET DEVICES
- Patent Title (中): FINFET器件的合并FIN结构
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Application No.: US14514900Application Date: 2014-10-15
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Publication No.: US20160111447A1Publication Date: 2016-04-21
- Inventor: Andres BRYANT , Brian J. GREENE , Jeffrey B. JOHNSON , Mickey H. YU
- Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Main IPC: H01L27/12
- IPC: H01L27/12 ; H01L29/161 ; H01L29/16 ; H01L21/84 ; H01L21/02

Abstract:
Merged fin structures for finFET devices and methods of manufacture are disclosed. The method of forming the structure includes forming a plurality of fin structures on an insulator layer. The method further includes forming a faceted structure on adjacent fin structures of the plurality of fin structures. The method further includes spanning a gap between the faceted structures on the adjacent fin structures with a semiconductor material.
Public/Granted literature
- US09312274B1 Merged fin structures for finFET devices Public/Granted day:2016-04-12
Information query
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