Invention Application
- Patent Title: SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Patent Title (中): 半导体器件及其制造方法
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Application No.: US14976411Application Date: 2015-12-21
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Publication No.: US20160111550A1Publication Date: 2016-04-21
- Inventor: Hiroki ADACHI , Kayo KUMAKURA
- Applicant: Semiconductor Energy Laboratory Co., Ltd.
- Priority: JP2013-081897 20130410
- Main IPC: H01L29/786
- IPC: H01L29/786

Abstract:
Provided is a flexible device with fewer defects caused by a crack or a flexible device having high productivity. A semiconductor device including: a display portion over a flexible substrate, including a transistor and a display element; a semiconductor layer surrounding the display portion; and an insulating layer over the transistor and the semiconductor layer. When seen in a direction perpendicular to a surface of the flexible substrate, an end portion of the substrate is substantially aligned with an end portion of the semiconductor layer, and an end portion of the insulating layer is positioned over the semiconductor layer.
Public/Granted literature
- US10134904B2 Semiconductor device having a flexible substrate and a crack-preventing semiconductor layer Public/Granted day:2018-11-20
Information query
IPC分类: