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    Fabrication Method of Semiconductor Device and Semiconductor Device
    3.
    发明申请
    Fabrication Method of Semiconductor Device and Semiconductor Device 审中-公开

    公开(公告)号：US20200067027A1

    公开(公告)日：2020-02-27

    申请号：US16493104

    申请日：2018-03-06

    Applicant: Semiconductor Energy Laboratory Co., Ltd.

    Inventor： Seiji YASUMOTO ,  Kayo KUMAKURA ,  Yuka SATO ,  Satoru IDOJIRI ,  Hiroki ADACHI ,  Kenichi OKAZAKI

    IPC: H01L51/56 ,  H01L51/00 ,  H01L51/52

    Abstract: A high-yield fabricating method of a semiconductor device including a peeling step is provided.A peeling method includes a step of stacking and forming a first material layer and a second material layer over a substrate and a step of separating the first material layer and the second material layer from each other. The second material layer is formed over the substrate with the first material layer therebetween. The first material layer includes a first compound layer in contact with the second material layer and a second compound layer positioned closer to the substrate side than the first compound layer is. The first compound layer has the highest oxygen content among the layers included in the first material layer. The second compound layer has the highest nitrogen content among the layers included in the first material layer. The second material layer includes a resin. In the step of separating, the first material layer and the second material layer are separated from each other by irradiation of an interface between the first material layer and the second material layer or the vicinity of the interface with light.

    SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
    5.
    发明申请
    SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF 有权
    半导体器件及其制造方法

    公开(公告)号：US20140306288A1

    公开(公告)日：2014-10-16

    申请号：US14246407

    申请日：2014-04-07

    Applicant: Semiconductor Energy Laboratory Co., Ltd.

    Inventor： Hiroki ADACHI ,  Kayo KUMAKURA

    IPC: H01L29/786 ,  H01L21/84

    CPC classification number: H01L29/78603 ,  H01L21/84 ,  H01L27/1218 ,  H01L27/1222 ,  H01L27/1262 ,  H01L29/78606 ,  H01L2021/775

    Abstract: Provided is a flexible device with fewer defects caused by a crack or a flexible device having high productivity. A semiconductor device including: a display portion over a flexible substrate, including a transistor and a display element; a semiconductor layer surrounding the display portion; and an insulating layer over the transistor and the semiconductor layer. When seen in a direction perpendicular to a surface of the flexible substrate, an end portion of the substrate is substantially aligned with an end portion of the semiconductor layer, and an end portion of the insulating layer is positioned over the semiconductor layer.

    Abstract translation: 提供了一种具有由裂纹引起的缺陷或具有高生产率的柔性装置的柔性装置。 一种半导体器件，包括：柔性基板上的显示部分，包括晶体管和显示元件; 围绕显示部的半导体层; 以及在晶体管和半导体层上的绝缘层。 当在与柔性基板的表面垂直的方向上观察时，基板的端部与半导体层的端部大致对准，绝缘层的端部位于半导体层的上方。

    FILM-LIKE MEMBER SUPPORT APPARATUS
    8.
    发明申请
    FILM-LIKE MEMBER SUPPORT APPARATUS 审中-公开
    类似电影的会员支持设备

    公开(公告)号：US20150314424A1

    公开(公告)日：2015-11-05

    申请号：US14696515

    申请日：2015-04-27

    Applicant: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.

    Inventor： Kayo KUMAKURA ,  Satoru IDOJIRI ,  Masakatsu OHNO ,  Koichi TAKESHIMA ,  Yoshiharu HIRAKATA ,  Kohei YOKOYAMA

    IPC: B25B11/00 ,  B29C53/18

    CPC classification number: B25B11/005 ,  B29C53/18 ,  B29L2007/002 ,  H01L21/68742 ,  H01L21/6875

    Abstract: A film-like member is supported in a flat shape by vacuum suction. A plurality of lift pins are arranged in a planar configuration and bear a film-like member placed on their upper ends. Tubular pads made of rubber for holding the film-like member by vacuum suction are attached to upper portions of the lift pins. The height of the lift pins can be adjusted by a screw fastening mechanism. The deformation of the film-like member can be corrected to a flat or concavely curved shape by suction from the pads. When the correction cannot be achieved by suction alone, the correction may be supplemented by ejection of air from a nozzle.

    Abstract translation: 膜状构件通过真空抽吸被支撑为平坦的形状。 多个提升销布置成平面构造并且承载放置在其上端的薄膜状构件。 由橡胶制成的用于通过真空吸附保持膜状构件的管状垫被附接到提升销的上部。 提升销的高度可以通过螺钉固定机构进行调整。 膜状构件的变形可以通过从衬垫的抽吸来校正为平坦或凹形弯曲的形状。 当仅通过抽吸不能实现校正时，可以通过从喷嘴喷出空气来补充校正。

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