Invention Application
- Patent Title: SOLID-STATE IMAGING DEVICE AND METHOD FOR MANUFACTURING THE SAME, AND ELECTRONIC APPARATUS
- Patent Title (中): 固态成像装置及其制造方法及电子装置
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Application No.: US14891947Application Date: 2014-06-20
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Publication No.: US20160112614A1Publication Date: 2016-04-21
- Inventor: Yoshiaki MASUDA , Yuki MIYANAMI , Hideshi ABE , Tomoyuki HIRANO , Masanari YAMAGUCHI , Yoshiki EBIKO , Kazufumi WATANABE , Tomoharu OGITA
- Applicant: SONY CORPORATION
- Priority: JP2013-139830 20130703; JP2014-104167 20140520
- International Application: PCT/JP2014/066400 WO 20140620
- Main IPC: H04N5/225
- IPC: H04N5/225

Abstract:
The present disclosure relates to a solid-state imaging device, a method for manufacturing the same, and an electronic apparatus capable of improving sensitivity while suppressing degradation of color mixture. The solid-state imaging device includes an anti-reflection portion having a moth-eye structure provided on a boundary surface on a light-receiving surface side of a photoelectric conversion region of each pixel arranged two-dimensionally, and an inter-pixel light-blocking portion provided below the boundary surface of the anti-reflection portion to block incident light. In addition, the photoelectric conversion region is a semiconductor region, and the inter-pixel light-blocking portion has a trench structure obtained by digging the semiconductor region in a depth direction at a pixel boundary. The techniques according to the present disclosure can be applied to, for example, a solid-state imaging device of a rear surface irradiation type.
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