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    SOLID-STATE IMAGING DEVICE, METHOD FOR PRODUCING SOLID-STATE IMAGING DEVICE AND ELECTRONIC APPARATUS
    1.
    发明申请
    SOLID-STATE IMAGING DEVICE, METHOD FOR PRODUCING SOLID-STATE IMAGING DEVICE AND ELECTRONIC APPARATUS 审中-公开

    公开(公告)号：US20190165023A1

    公开(公告)日：2019-05-30

    申请号：US16265634

    申请日：2019-02-01

    Applicant: SONY CORPORATION

    Inventor： Takayuki ENOMOTO ,  Yoshiki EBIKO

    IPC: H01L27/146

    CPC classification number: H01L27/14623 ,  H01L27/14607 ,  H01L27/14612 ,  H01L27/1463 ,  H01L27/1464 ,  H01L27/14643 ,  H01L27/14689

    Abstract: A solid-state imaging device, method for producing solid-state imaging device and electronic apparatus are provided. The solid-state imaging device includes a substrate, with a plurality of pixels formed in the substrate. In addition, a plurality of groups are formed in the substrate, and in particular in pixel isolation regions between adjacent pixels. The grooves extend from a first surface of the substrate towards a second surface of the substrate. An embedded film extends into the grooves. At least some of the grooves include a first stage near the first surface of the substrate and a second stage near the second surface of the substrate that are defined by walls of the grooves, wherein the first stage is wider than the second stage, and wherein a step is present between the first and second stages. In addition, the device includes a light shielding film adjacent the first surface of the substrate that overlies the grooves. A portion of the light shielding film is embedded in the embedded film that extends into the grooves.

    SOLID-STATE IMAGING DEVICE, METHOD FOR PRODUCING SOLID-STATE IMAGING DEVICE AND ELECTRONIC APPARATUS
    2.
    发明申请
    SOLID-STATE IMAGING DEVICE, METHOD FOR PRODUCING SOLID-STATE IMAGING DEVICE AND ELECTRONIC APPARATUS 审中-公开

    公开(公告)号：US20170323918A1

    公开(公告)日：2017-11-09

    申请号：US15656873

    申请日：2017-07-21

    Applicant: SONY CORPORATION

    Inventor： Takayuki ENOMOTO ,  Yoshiki EBIKO

    IPC: H01L27/146

    CPC classification number: H01L27/14623 ,  H01L27/14607 ,  H01L27/14612 ,  H01L27/1463 ,  H01L27/1464 ,  H01L27/14643 ,  H01L27/14689

    Abstract: A solid-state imaging device, method for producing solid-state imaging device and electronic apparatus are provided. The solid-state imaging device includes a substrate, with a plurality of pixels formed in the substrate. In addition, a plurality of groups are formed in the substrate, and in particular in pixel isolation regions between adjacent pixels. The grooves extend from a first surface of the substrate towards a second surface of the substrate. An embedded film extends into the grooves. At least some of the grooves include a first stage near the first surface of the substrate and a second stage near the second surface of the substrate that are defined by walls of the grooves, wherein the first stage is wider than the second stage, and wherein a step is present between the first and second stages. In addition, the device includes a light shielding film adjacent the first surface of the substrate that overlies the grooves. A portion of the light shielding film is embedded in the embedded film that extends into the grooves.

    SOLID-STATE IMAGING DEVICE AND METHOD FOR MANUFACTURING THE SAME, AND ELECTRONIC APPARATUS
    9.
    发明申请
    SOLID-STATE IMAGING DEVICE AND METHOD FOR MANUFACTURING THE SAME, AND ELECTRONIC APPARATUS 有权
    固态成像装置及其制造方法及电子装置

    公开(公告)号：US20160112614A1

    公开(公告)日：2016-04-21

    申请号：US14891947

    申请日：2014-06-20

    Applicant: SONY CORPORATION

    Inventor： Yoshiaki MASUDA ,  Yuki MIYANAMI ,  Hideshi ABE ,  Tomoyuki HIRANO ,  Masanari YAMAGUCHI ,  Yoshiki EBIKO ,  Kazufumi WATANABE ,  Tomoharu OGITA

    IPC: H04N5/225

    CPC classification number: H04N5/2254 ,  G02B1/118 ,  H01L27/14621 ,  H01L27/14623 ,  H01L27/14627 ,  H01L27/14629 ,  H01L27/1463 ,  H01L27/1464 ,  H01L31/02327 ,  H01L31/10 ,  H04N5/359 ,  H04N5/369 ,  H04N5/3696 ,  H04N5/374 ,  H04N9/04

    Abstract: The present disclosure relates to a solid-state imaging device, a method for manufacturing the same, and an electronic apparatus capable of improving sensitivity while suppressing degradation of color mixture. The solid-state imaging device includes an anti-reflection portion having a moth-eye structure provided on a boundary surface on a light-receiving surface side of a photoelectric conversion region of each pixel arranged two-dimensionally, and an inter-pixel light-blocking portion provided below the boundary surface of the anti-reflection portion to block incident light. In addition, the photoelectric conversion region is a semiconductor region, and the inter-pixel light-blocking portion has a trench structure obtained by digging the semiconductor region in a depth direction at a pixel boundary. The techniques according to the present disclosure can be applied to, for example, a solid-state imaging device of a rear surface irradiation type.

    Abstract translation: 本公开内容涉及固态成像装置，其制造方法以及能够在抑制混色劣化的同时提高灵敏度的电子装置。 固态成像装置包括具有设置在二维布置的每个像素的光电转换区域的受光面侧的边界面上的飞蛾眼结构的防反射部， 阻挡部分设置在防反射部分的边界表面下方以阻挡入射光。 另外，光电转换区域是半导体区域，并且像素间阻挡部分具有通过在像素边界沿深度方向挖掘半导体区域而获得的沟槽结构。 根据本公开的技术可以应用于例如后表面照射型的固态成像装置。

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