Invention Application
- Patent Title: Automated Pattern Fidelity Measurement Plan Generation
- Patent Title (中): 自动图案保真度测量计划生成
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Application No.: US14918394Application Date: 2015-10-20
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Publication No.: US20160116420A1Publication Date: 2016-04-28
- Inventor: Brian Duffy , Ajay Gupta , Thanh Huy Ha
- Applicant: KLA-Tencor Corporation
- Main IPC: G01N21/88
- IPC: G01N21/88 ; G01N23/00 ; G01N21/95

Abstract:
Methods and systems for determining parameter(s) of a metrology process to be performed on a specimen are provided. One system includes one or more computer subsystems configured for automatically generating regions of interest (ROIs) to be measured during a metrology process performed for the specimen with the measurement subsystem based on a design for the specimen. The computer subsystem(s) are also configured for automatically determining parameter(s) of measurement(s) performed in first and second subsets of the ROIs during the metrology process with the measurement subsystem based on portions of the design for the specimen located in the first and second subsets of the ROIs, respectively. The parameter(s) of the measurement(s) performed in the first subset are determined separately and independently of the parameter(s) of the measurement(s) performed in the second subset.
Public/Granted literature
- US10267746B2 Automated pattern fidelity measurement plan generation Public/Granted day:2019-04-23
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