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    Automated pattern fidelity measurement plan generation
    1.
    发明授权
    Automated pattern fidelity measurement plan generation 审中-公开

    公开(公告)号：US10670535B2

    公开(公告)日：2020-06-02

    申请号：US16296132

    申请日：2019-03-07

    Applicant: KLA-Tencor Corporation

    Inventor： Brian Duffy ,  Ajay Gupta ,  Thanh Huy Ha

    IPC: G01N21/88 ,  G03F7/20 ,  G01N21/95 ,  G01N23/00 ,  G01N21/956

    Abstract: Methods and systems for determining parameter(s) of a metrology process to be performed on a specimen are provided. One system includes one or more computer subsystems configured for automatically generating regions of interest (ROIs) to be measured during a metrology process performed for the specimen with the measurement subsystem based on a design for the specimen. The computer subsystem(s) are also configured for automatically determining parameter(s) of measurement(s) performed in first and second subsets of the ROIs during the metrology process with the measurement subsystem based on portions of the design for the specimen located in the first and second subsets of the ROIs, respectively. The parameter(s) of the measurement(s) performed in the first subset are determined separately and independently of the parameter(s) of the measurement(s) performed in the second subset.

    Automated pattern fidelity measurement plan generation
    2.
    发明授权
    Automated pattern fidelity measurement plan generation 有权

    公开(公告)号：US10267746B2

    公开(公告)日：2019-04-23

    申请号：US14918394

    申请日：2015-10-20

    Applicant: KLA-Tencor Corporation

    Inventor： Brian Duffy ,  Ajay Gupta ,  Thanh Huy Ha

    IPC: G01N21/88 ,  G01N23/00 ,  G01N21/95 ,  G03F7/20 ,  G01N21/956

    Abstract: Methods and systems for determining parameter(s) of a metrology process to be performed on a specimen are provided. One system includes one or more computer subsystems configured for automatically generating regions of interest (ROIs) to be measured during a metrology process performed for the specimen with the measurement subsystem based on a design for the specimen. The computer subsystem(s) are also configured for automatically determining parameter(s) of measurement(s) performed in first and second subsets of the ROIs during the metrology process with the measurement subsystem based on portions of the design for the specimen located in the first and second subsets of the ROIs, respectively. The parameter(s) of the measurement(s) performed in the first subset are determined separately and independently of the parameter(s) of the measurement(s) performed in the second subset.

    Automated Pattern Fidelity Measurement Plan Generation
    3.
    发明申请
    Automated Pattern Fidelity Measurement Plan Generation 审中-公开
    自动图案保真度测量计划生成

    公开(公告)号：US20160116420A1

    公开(公告)日：2016-04-28

    申请号：US14918394

    申请日：2015-10-20

    Applicant: KLA-Tencor Corporation

    Inventor： Brian Duffy ,  Ajay Gupta ,  Thanh Huy Ha

    IPC: G01N21/88 ,  G01N23/00 ,  G01N21/95

    CPC classification number: G01N21/8851 ,  G01N21/9501 ,  G01N21/956 ,  G01N23/00 ,  G01N2021/8883 ,  G03F7/70625

    Abstract: Methods and systems for determining parameter(s) of a metrology process to be performed on a specimen are provided. One system includes one or more computer subsystems configured for automatically generating regions of interest (ROIs) to be measured during a metrology process performed for the specimen with the measurement subsystem based on a design for the specimen. The computer subsystem(s) are also configured for automatically determining parameter(s) of measurement(s) performed in first and second subsets of the ROIs during the metrology process with the measurement subsystem based on portions of the design for the specimen located in the first and second subsets of the ROIs, respectively. The parameter(s) of the measurement(s) performed in the first subset are determined separately and independently of the parameter(s) of the measurement(s) performed in the second subset.

    Abstract translation: 提供了用于确定要在样本上执行的计量过程的参数的方法和系统。 一个系统包括一个或多个计算机子系统，其被配置为在基于样本的设计的测量子系统为样本执行的度量过程期间自动生成要测量的感兴趣区域（ROI）。 计算机子系统还被配置为在测量子系统的计量过程中自动确定在ROI的第一和第二子集中执行的测量参数，其基于位于 ROI的第一和第二子集。 在第一子集中执行的测量的参数被分开地和独立于在第二子集中执行的测量的参数来确定。

    DETERMINING MULTI-PATTERNING STEP OVERLAY ERROR
    4.
    发明申请
    DETERMINING MULTI-PATTERNING STEP OVERLAY ERROR 审中-公开
    确定多模式步骤覆盖错误

    公开(公告)号：US20160377425A1

    公开(公告)日：2016-12-29

    申请号：US15170881

    申请日：2016-06-01

    Applicant: KLA-Tencor Corporation

    Inventor： Ajay Gupta ,  Thanh Huy Ha ,  Olivier Moreau ,  Kumar Raja

    IPC: G01B15/00 ,  H01J37/22 ,  G01B11/27 ,  H01L21/67 ,  H01L21/68

    CPC classification number: H01J37/222 ,  G03F7/70633 ,  H01J2237/221 ,  H01J2237/24578 ,  H01J2237/31798

    Abstract: Methods and systems for determining overlay error between different patterned features of a design printed on a wafer in a multi-patterning step process are provided. For multi-patterning step designs, the design for a first patterning step is used as a reference and designs for each of the remaining patterning steps are synthetically shifted until the synthetically shifted designs have the best global alignment with the entire image based on global image-to-design alignment. The final synthetic shift of each design for each patterning step relative to the design for the first patterning step provides a measurement of relative overlay error between any two features printed on the wafer using multi-patterning technology.

    Abstract translation: 提供了用于在多图案化步骤过程中确定印刷在晶片上的设计的不同图案特征之间确定覆盖误差的方法和系统。 对于多图案化步骤设计，将第一图案化步骤的设计用作参考，并且对于每个剩余的图案化步骤的设计被合成移位，直到合成移位的设计基于全局图像步骤与整个图像具有最佳的全局对准， 设计对齐。 相对于第一图案化步骤的设计，每个图案化步骤的每个设计的最终合成位移提供了使用多图案化技术印刷在晶片上的任何两个特征之间的相对重叠误差的测量。

    Learning based approach for aligning images acquired with different modalities
    6.
    发明授权
    Learning based approach for aligning images acquired with different modalities 有权

    公开(公告)号：US10733744B2

    公开(公告)日：2020-08-04

    申请号：US15927011

    申请日：2018-03-20

    Applicant: KLA-Tencor Corporation

    Inventor： Thanh Huy Ha ,  Scott A. Young ,  Mohan Mahadevan

    IPC: G06K9/00 ,  G06T7/30 ,  G06K9/62 ,  H01J37/26 ,  G06F30/00

    Abstract: Methods and systems for aligning images for a specimen acquired with different modalities are provided. One method includes acquiring information for a specimen that includes at least first and second images for the specimen. The first image is acquired with a first modality different than a second modality used to acquire the second image. The method also includes inputting the information into a learning based model. The learning based model is included in one or more components executed by one or more computer systems. The learning based model is configured for transforming one or more of the at least first and second images to thereby render the at least the first and second images into a common space. In addition, the method includes aligning the at least the first and second images using results of the transforming. The method may also include generating an alignment metric using a classifier.

    Automated Pattern Fidelity Measurement Plan Generation
    7.
    发明申请
    Automated Pattern Fidelity Measurement Plan Generation 审中-公开

    公开(公告)号：US20190204237A1

    公开(公告)日：2019-07-04

    申请号：US16296132

    申请日：2019-03-07

    Applicant: KLA-Tencor Corporation

    Inventor： Brian Duffy ,  Ajay Gupta ,  Thanh Huy Ha

    IPC: G01N21/88 ,  G01N23/00 ,  G03F7/20 ,  G01N21/95

    Abstract: Methods and systems for determining parameter(s) of a metrology process to be performed on a specimen are provided. One system includes one or more computer subsystems configured for automatically generating regions of interest (Rats) to be measured during a metrology process performed for the specimen with the measurement subsystem based on a design for the specimen. The computer subsystem(s) are also configured for automatically determining parameter(s) of measurement(s) performed in first and second subsets of the ROIs during the metrology process with the measurement subsystem based on portions of the design for the specimen located in the first and second subsets of the ROIs, respectively. The parameter(s) of the measurement(s) performed in the first subset are determined separately and independently of the parameter(s) of the measurement(s) performed in the second subset.

    LEARNING BASED APPROACH FOR ALIGNING IMAGES ACQUIRED WITH DIFFERENT MODALITIES
    8.
    发明申请
    LEARNING BASED APPROACH FOR ALIGNING IMAGES ACQUIRED WITH DIFFERENT MODALITIES 审中-公开

    公开(公告)号：US20180330511A1

    公开(公告)日：2018-11-15

    申请号：US15927011

    申请日：2018-03-20

    Applicant: KLA-Tencor Corporation

    Inventor： Thanh Huy Ha ,  Scott A. Young ,  Mohan Mahadevan

    IPC: G06T7/30 ,  G06K9/62 ,  G06F17/50 ,  H01J37/26

    Abstract: Methods and systems for aligning images for a specimen acquired with different modalities are provided. One method includes acquiring information for a specimen that includes at least first and second images for the specimen. The first image is acquired with a first modality different than a second modality used to acquire the second image. The method also includes inputting the information into a learning based model. The learning based model is included in one or more components executed by one or more computer systems. The learning based model is configured for transforming one or more of the at least first and second images to thereby render the at least the first and second images into a common space. In addition, the method includes aligning the at least the first and second images using results of the transforming. The method may also include generating an alignment metric using a classifier.

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