Invention Application
US20160121453A1 METHODS AND APPARATUS FOR PROFILE AND SURFACE PREPARATION OF RETAINING RINGS UTILIZED IN CHEMICAL MECHANICAL POLISHING PROCESSES
审中-公开
用于化学机械抛光过程中使用的保持环的剖面和表面准备的方法和装置
- Patent Title: METHODS AND APPARATUS FOR PROFILE AND SURFACE PREPARATION OF RETAINING RINGS UTILIZED IN CHEMICAL MECHANICAL POLISHING PROCESSES
- Patent Title (中): 用于化学机械抛光过程中使用的保持环的剖面和表面准备的方法和装置
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Application No.: US14879526Application Date: 2015-10-09
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Publication No.: US20160121453A1Publication Date: 2016-05-05
- Inventor: David Masayuki ISHIKAWA , Jeonghoon OH , Garrett Ho Yee SIN , Charles C. GARRETSON , Huanbo ZHANG , Chia-Ling PAI , Niraj PRASAD , Julio David MUZQUIZ
- Applicant: Applied Materials, Inc.
- Main IPC: B24B37/32
- IPC: B24B37/32
Abstract:
A retaining ring for a polishing process is disclosed. The retaining ring includes a body comprising an upper portion and a lower portion, and a sacrificial surface disposed on the lower portion, the sacrificial surface comprising a negative tapered surface having a taper height that is about 0.0003 inches to about 0.00015 inches.
Public/Granted literature
Information query
