-
公开(公告)号：US20190105754A1
公开(公告)日：2019-04-11
申请号：US16210859
申请日：2018-12-05
Applicant: Applied Materials, Inc.
Inventor： David Masayuki ISHIKAWA , Jeonghoon OH , Garrett Ho Yee SIN , Charles C. GARRETSON , Huanbo ZHANG , Chia-Ling PAI , Niraj PRASAD , Julio David MUZQUIZ
IPC: B24B37/32
Abstract: A retaining ring for a polishing process is disclosed. The retaining ring includes a body comprising an upper portion and a lower portion, and a sacrificial surface disposed on the lower portion, the sacrificial surface comprising a negative tapered surface having a taper height that is about 0.0003 inches to about 0.00015 inches.
-
2.发明申请METHODS AND APPARATUS FOR PROFILE AND SURFACE PREPARATION OF RETAINING RINGS UTILIZED IN CHEMICAL MECHANICAL POLISHING PROCESSES 审中-公开用于化学机械抛光过程中使用的保持环的剖面和表面准备的方法和装置公开(公告)号：US20160121453A1
公开(公告)日：2016-05-05
申请号：US14879526
申请日：2015-10-09
Applicant: Applied Materials, Inc.
Inventor： David Masayuki ISHIKAWA , Jeonghoon OH , Garrett Ho Yee SIN , Charles C. GARRETSON , Huanbo ZHANG , Chia-Ling PAI , Niraj PRASAD , Julio David MUZQUIZ
IPC: B24B37/32
CPC classification number: B24B37/32
Abstract: A retaining ring for a polishing process is disclosed. The retaining ring includes a body comprising an upper portion and a lower portion, and a sacrificial surface disposed on the lower portion, the sacrificial surface comprising a negative tapered surface having a taper height that is about 0.0003 inches to about 0.00015 inches.
Abstract translation: 公开了一种用于抛光工艺的保持环。 保持环包括包括上部和下部的主体以及设置在下部上的牺牲表面，牺牲表面包括具有约0.0003英寸至约0.00015英寸的锥形高度的负锥形表面。
-
Search Results
2
records
(took 0.01 seconds)
