公开(公告)号：US20170274497A1

公开(公告)日：2017-09-28

申请号：US15456320

申请日：2017-03-10

Applicant: Applied Materials, Inc.

Inventor： Eric LAU ,  Hui CHEN ,  King Yi HEUNG ,  Wei-Cheng LEE ,  Chih Chung CHOU ,  Edwin C. SUAREZ ,  Garrett Ho Yee SIN ,  Charles C. GARRETSON ,  Jeonghoon OH

IPC: B24B37/26 ,  B24B37/30

CPC classification number: B24B37/26 ,  B24B37/30

Abstract: A polishing module including a chuck having a substrate receiving surface and a perimeter, and one or more polishing pad assemblies positioned about the perimeter of the chuck, wherein each of the one or more polishing pad assemblies are coupled to an actuator that provides movement of the respective polishing pad assemblies in one or more of a sweep direction, a radial direction, and a oscillating mode relative to the substrate receiving surface and are limited in radial movement to about less than one-half of the radius of the chuck as measured from the perimeter of the chuck.

公开(公告)号：US20170274495A1

公开(公告)日：2017-09-28

申请号：US15456413

申请日：2017-03-10

Applicant: Applied Materials, Inc.

Inventor： Eric LAU ,  Hui CHEN ,  King Yi HEUNG ,  Chih Chung CHOU ,  Edwin C. SUAREZ ,  Garrett Ho Yee SIN ,  Charles C. GARRETSON ,  Jeonghoon OH

IPC: B24B37/10 ,  H01L21/687 ,  H01L21/67 ,  B24B37/20 ,  B24B57/02

CPC classification number: B24B37/10 ,  B24B37/20 ,  B24B57/02 ,  H01L21/67092 ,  H01L21/68785

Abstract: A polishing module includes a chuck having a substrate receiving surface and a perimeter, and one or more polishing pad assemblies positioned about the perimeter of the chuck, wherein each of the one or more polishing pad assemblies are coupled to an actuator that provides movement of the respective polishing pad assemblies in a sweep direction, a radial direction, and a oscillating mode relative to the substrate receiving surface and are limited in radial movement to about less than one-half of the radius of the chuck as measured from the perimeter of the chuck.

公开(公告)号：US20190105754A1

公开(公告)日：2019-04-11

申请号：US16210859

申请日：2018-12-05

Applicant: Applied Materials, Inc.

Inventor： David Masayuki ISHIKAWA ,  Jeonghoon OH ,  Garrett Ho Yee SIN ,  Charles C. GARRETSON ,  Huanbo ZHANG ,  Chia-Ling PAI ,  Niraj PRASAD ,  Julio David MUZQUIZ

IPC: B24B37/32

Abstract: A retaining ring for a polishing process is disclosed. The retaining ring includes a body comprising an upper portion and a lower portion, and a sacrificial surface disposed on the lower portion, the sacrificial surface comprising a negative tapered surface having a taper height that is about 0.0003 inches to about 0.00015 inches.

公开(公告)号：US20230023915A1

公开(公告)日：2023-01-26

申请号：US17381913

申请日：2021-07-21

Applicant: Applied Materials, Inc.

Inventor： Thomas Lawrence TERRY ,  Garrett Ho Yee SIN ,  Basavaraja Shankarappa KENGUNTI

IPC: B24B37/32

Abstract: Embodiments of the disclosure generally relate to a retaining ring assembly having an annular lower portion, and an annular upper portion. The annular lower portion includes a step feature and an interlocking feature. In some configurations, adhesive is selective deposited on the step feature and the interlocking feature. The annular upper portion includes an opposing step recess, a first gap feature, an opposing interlocking recess and a second gap feature. When the upper portion and the lower portion are mated together, the interlocking recess is snapped into the upper portion tightly securing the lower portion to the upper portion.

公开(公告)号：US20160121453A1

公开(公告)日：2016-05-05

申请号：US14879526

申请日：2015-10-09

Applicant: Applied Materials, Inc.

Inventor： David Masayuki ISHIKAWA ,  Jeonghoon OH ,  Garrett Ho Yee SIN ,  Charles C. GARRETSON ,  Huanbo ZHANG ,  Chia-Ling PAI ,  Niraj PRASAD ,  Julio David MUZQUIZ

IPC: B24B37/32

CPC classification number: B24B37/32

Abstract: A retaining ring for a polishing process is disclosed. The retaining ring includes a body comprising an upper portion and a lower portion, and a sacrificial surface disposed on the lower portion, the sacrificial surface comprising a negative tapered surface having a taper height that is about 0.0003 inches to about 0.00015 inches.

Abstract translation: 公开了一种用于抛光工艺的保持环。 保持环包括包括上部和下部的主体以及设置在下部上的牺牲表面，牺牲表面包括具有约0.0003英寸至约0.00015英寸的锥形高度的负锥形表面。