Invention Application
- Patent Title: Wafer Defect Discovery
- Patent Title (中): 晶圆缺陷发现
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Application No.: US14931226Application Date: 2015-11-03
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Publication No.: US20160123898A1Publication Date: 2016-05-05
- Inventor: Hong Chen , Kenong Wu , Martin Plihal , Vidur Pandita , Ravikumar Sanapala , Vivek Bhagat , Rahul Lakhawat , Oksen Baris , Rajesh Ramachandran , Naoshin Haque
- Applicant: KLA-Tencor Corporation
- Main IPC: G01N21/95
- IPC: G01N21/95

Abstract:
Systems and methods for discovering defects on a wafer are provided. One method includes detecting defects on a wafer by applying a threshold to output generated by a detector in a first scan of the wafer and determining values for features of the detected defects. The method also includes automatically ranking the features, identifying feature cut-lines to group the defect into bins, and, for each of the bins, determining one or more parameters that if applied to the values for the features of the defects in each of the bins will result in a predetermined number of the defects in each of the bins. The method also includes applying the one or more determined parameters to the output generated by the detector in a second scan of the wafer to generate a defect population that has a predetermined defect count and is diversified in the values for the features.
Public/Granted literature
- US09518934B2 Wafer defect discovery Public/Granted day:2016-12-13
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