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    Wafer Defect Discovery
    1.
    发明申请
    Wafer Defect Discovery 有权
    晶圆缺陷发现

    公开(公告)号：US20160123898A1

    公开(公告)日：2016-05-05

    申请号：US14931226

    申请日：2015-11-03

    Applicant: KLA-Tencor Corporation

    Inventor： Hong Chen ,  Kenong Wu ,  Martin Plihal ,  Vidur Pandita ,  Ravikumar Sanapala ,  Vivek Bhagat ,  Rahul Lakhawat ,  Oksen Baris ,  Rajesh Ramachandran ,  Naoshin Haque

    IPC: G01N21/95

    CPC classification number: H01J37/28 ,  G01N21/8851 ,  G01N21/9501 ,  G01N2021/8854 ,  G01N2021/8883 ,  G03F7/70625 ,  G03F7/7065 ,  H01J2237/24592

    Abstract: Systems and methods for discovering defects on a wafer are provided. One method includes detecting defects on a wafer by applying a threshold to output generated by a detector in a first scan of the wafer and determining values for features of the detected defects. The method also includes automatically ranking the features, identifying feature cut-lines to group the defect into bins, and, for each of the bins, determining one or more parameters that if applied to the values for the features of the defects in each of the bins will result in a predetermined number of the defects in each of the bins. The method also includes applying the one or more determined parameters to the output generated by the detector in a second scan of the wafer to generate a defect population that has a predetermined defect count and is diversified in the values for the features.

    Abstract translation: 提供了发现晶片缺陷的系统和方法。 一种方法包括通过在晶片的第一次扫描中施加由检测器产生的输出的阈值来检测晶片上的缺陷，并确定检测到的缺陷的特征的值。 该方法还包括对特征进行自动排序，识别特征切割线以将缺陷分组成箱，并且对于每个箱，确定一个或多个参数，如果应用于每个中的缺陷的特征的值 箱将导致每个箱中预定数量的缺陷。 该方法还包括将一个或多个确定的参数应用于在晶片的第二次扫描中由检测器产生的输出，以产生具有预定缺陷计数并且在特征值中多样化的缺陷群体。

    Wafer Defect Discovery
    2.
    发明申请
    Wafer Defect Discovery 审中-公开
    晶圆缺陷发现

    公开(公告)号：US20170076911A1

    公开(公告)日：2017-03-16

    申请号：US15359589

    申请日：2016-11-22

    Applicant: KLA-Tencor Corporation

    Inventor： Hong Chen ,  Kenong Wu ,  Martin Plihal ,  Vidur Pandita ,  Ravikumar Sanapala ,  Vivek Bhagat ,  Rahul Lakhawat ,  Oksen Baris ,  Rajesh Ramachandran ,  Naoshin Haque

    IPC: H01J37/28

    CPC classification number: H01J37/28 ,  G01N21/8851 ,  G01N21/9501 ,  G01N2021/8854 ,  G01N2021/8883 ,  G03F7/70625 ,  G03F7/7065 ,  H01J2237/24592

    Abstract: Systems and methods for discovering defects on a wafer are provided. One method includes detecting defects on a wafer by applying a threshold to output generated by a detector in a first scan of the wafer and determining values for features of the detected defects. The method also includes automatically ranking the features, identifying feature cut-lines to group the defect into bins, and, for each of the bins, determining one or more parameters that if applied to the values for the features of the defects in each of the bins will result in a predetermined number of the defects in each of the bins. The method also includes applying the one or more determined parameters to the output generated by the detector in a second scan of the wafer to generate a defect population that has a predetermined defect count and is diversified in the values for the features.

    Abstract translation: 提供了发现晶片缺陷的系统和方法。 一种方法包括通过在晶片的第一次扫描中施加由检测器产生的输出的阈值来检测晶片上的缺陷，并确定检测到的缺陷的特征的值。 该方法还包括对特征进行自动排序，识别特征切割线以将缺陷分组成箱，并且对于每个箱，确定一个或多个参数，如果应用于每个中的缺陷的特征的值 箱将导致每个箱中预定数量的缺陷。 该方法还包括将一个或多个确定的参数应用于在晶片的第二次扫描中由检测器产生的输出，以产生具有预定缺陷计数并且在特征值中多样化的缺陷群体。

    Optical mode analysis with design-based care areas
    3.
    发明授权
    Optical mode analysis with design-based care areas 有权

    公开(公告)号：US09702827B1

    公开(公告)日：2017-07-11

    申请号：US14946604

    申请日：2015-11-19

    Applicant: KLA-Tencor Corporation

    Inventor： Bjorn Brauer ,  Ravikumar Sanapala

    IPC: G01N21/00 ,  G01N21/88 ,  G01N21/95

    CPC classification number: G01N21/8851 ,  G01N21/9501 ,  G01N2201/11

    Abstract: Methods and systems for selecting one or more modes of an inspection subsystem or system for inspection of a specimen are provided. The systems described herein are configured to acquire output for all of the modes to be considered at a location of a known defect on the specimen by aligning output, which is generated at the location with a mode known to generate output in which patterned features on the specimen are resolved to a degree that allows the output to be aligned to design data, with the design data for the specimen to identify the location with substantially high accuracy and then without moving the field of view of the inspection subsystem or system from that location, acquiring the output for all other modes. All of the acquired output can then be used to select mode(s) for inspection of the specimen or another specimen of the same type.

    System and Method for Dynamic Care Area Generation on an Inspection Tool
    4.
    发明申请
    System and Method for Dynamic Care Area Generation on an Inspection Tool 有权
    检查工具动态护理区域生成的系统和方法

    公开(公告)号：US20160377561A1

    公开(公告)日：2016-12-29

    申请号：US15166591

    申请日：2016-05-27

    Applicant: KLA-Tencor Corporation

    Inventor： Vijayakumar Ramachandran ,  Ravikumar Sanapala ,  Vidyasagar Anantha ,  Philip Measor ,  Rajesh Manepalli ,  Jing Fang

    IPC: G01N23/225 ,  G01N21/956 ,  G01N21/95

    CPC classification number: G01N21/9501 ,  G01N21/95607 ,  G01N2021/8854 ,  G01N2021/95615 ,  G01N2223/6116 ,  G01N2223/646 ,  H01L22/12 ,  H01L22/20

    Abstract: A defect inspection system includes an inspection sub-system and a controller communicatively coupled to the detector. The inspection sub-system includes an illumination source configured to generate a beam of illumination, a set of illumination optics to direct the beam of illumination to a sample, and a detector configured to collect illumination emanating from the sample. The controller includes a memory device and one or more processors configured to execute program instructions. The controller is configured to determine one or more target patterns corresponding to one or more features on the sample, define one or more care areas on the sample based on the one or more target patterns and design data of the sample stored within the memory device of the controller, and identify one or more defects within the one or more care areas of the sample based on the illumination collected by the detector.

    Abstract translation: 缺陷检查系统包括检测子系统和通信地耦合到检测器的控制器。 检查子系统包括被配置为产生照射束的照明源，一组用于将照射束引导到样本的照明光学器件，以及被配置为收集从样品发出的照明的检测器。 控制器包括存储器设备和被配置为执行程序指令的一个或多个处理器。 控制器被配置为确定与样本上的一个或多个特征相对应的一个或多个目标模式，基于存储在存储器装置内的样本的一个或多个目标模式和样本的设计数据来定义样本上的一个或多个保养区域 控制器，并且基于由检测器收集的照明来识别样品的一个或多个护理区域内的一个或多个缺陷。

    Wafer defect discovery
    6.
    发明授权
    Wafer defect discovery 有权
    晶圆缺陷发现

    公开(公告)号：US09518934B2

    公开(公告)日：2016-12-13

    申请号：US14931226

    申请日：2015-11-03

    Applicant: KLA-Tencor Corporation

    Inventor： Hong Chen ,  Kenong Wu ,  Martin Plihal ,  Vidur Pandita ,  Ravikumar Sanapala ,  Vivek Bhagat ,  Rahul Lakhawat ,  Oksen Baris ,  Rajesh Ramachandran ,  Naoshin Haque

    IPC: G01N21/00 ,  G01N21/95 ,  G01N21/88 ,  G03F7/20

    CPC classification number: H01J37/28 ,  G01N21/8851 ,  G01N21/9501 ,  G01N2021/8854 ,  G01N2021/8883 ,  G03F7/70625 ,  G03F7/7065 ,  H01J2237/24592

    Abstract: Systems and methods for discovering defects on a wafer are provided. One method includes detecting defects on a wafer by applying a threshold to output generated by a detector in a first scan of the wafer and determining values for features of the detected defects. The method also includes automatically ranking the features, identifying feature cut-lines to group the defect into bins, and, for each of the bins, determining one or more parameters that if applied to the values for the features of the defects in each of the bins will result in a predetermined number of the defects in each of the bins. The method also includes applying the one or more determined parameters to the output generated by the detector in a second scan of the wafer to generate a defect population that has a predetermined defect count and is diversified in the values for the features.

    Abstract translation: 提供了发现晶片缺陷的系统和方法。 一种方法包括通过在晶片的第一次扫描中施加由检测器产生的输出的阈值来检测晶片上的缺陷，并确定检测到的缺陷的特征的值。 该方法还包括对特征进行自动排序，识别特征切割线以将缺陷分组成箱，并且对于每个箱，确定一个或多个参数，如果应用于每个中的缺陷的特征的值 箱将导致每个箱中预定数量的缺陷。 该方法还包括将一个或多个确定的参数应用于在晶片的第二次扫描中由检测器产生的输出，以产生具有预定缺陷计数并且在特征值中多样化的缺陷群体。

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