公开(公告)号：US09518934B2

公开(公告)日：2016-12-13

申请号：US14931226

申请日：2015-11-03

Applicant: KLA-Tencor Corporation

Inventor： Hong Chen ,  Kenong Wu ,  Martin Plihal ,  Vidur Pandita ,  Ravikumar Sanapala ,  Vivek Bhagat ,  Rahul Lakhawat ,  Oksen Baris ,  Rajesh Ramachandran ,  Naoshin Haque

IPC: G01N21/00 ,  G01N21/95 ,  G01N21/88 ,  G03F7/20

CPC classification number: H01J37/28 ,  G01N21/8851 ,  G01N21/9501 ,  G01N2021/8854 ,  G01N2021/8883 ,  G03F7/70625 ,  G03F7/7065 ,  H01J2237/24592

Abstract: Systems and methods for discovering defects on a wafer are provided. One method includes detecting defects on a wafer by applying a threshold to output generated by a detector in a first scan of the wafer and determining values for features of the detected defects. The method also includes automatically ranking the features, identifying feature cut-lines to group the defect into bins, and, for each of the bins, determining one or more parameters that if applied to the values for the features of the defects in each of the bins will result in a predetermined number of the defects in each of the bins. The method also includes applying the one or more determined parameters to the output generated by the detector in a second scan of the wafer to generate a defect population that has a predetermined defect count and is diversified in the values for the features.

Abstract translation: 提供了发现晶片缺陷的系统和方法。 一种方法包括通过在晶片的第一次扫描中施加由检测器产生的输出的阈值来检测晶片上的缺陷，并确定检测到的缺陷的特征的值。 该方法还包括对特征进行自动排序，识别特征切割线以将缺陷分组成箱，并且对于每个箱，确定一个或多个参数，如果应用于每个中的缺陷的特征的值 箱将导致每个箱中预定数量的缺陷。 该方法还包括将一个或多个确定的参数应用于在晶片的第二次扫描中由检测器产生的输出，以产生具有预定缺陷计数并且在特征值中多样化的缺陷群体。

公开(公告)号：US10740888B2

公开(公告)日：2020-08-11

申请号：US15275726

申请日：2016-09-26

Applicant: KLA-Tencor Corporation

Inventor： Naoshin Haque ,  Allen Park ,  Ajay Gupta

IPC: G06T7/00 ,  H01L21/66

Abstract: Methods and systems for providing weak pattern (or hotspot) detection and quantification are disclosed. A weak pattern detection and quantification system may include a wafer inspection tool configured to inspect a wafer and detect defects present on the wafer. The system may also include at least one processor in communication with the wafer inspection tool. The at least one processor may be configured to: perform pattern grouping on the detected defects based on design of the wafer; identify regions of interest based on the pattern grouping; identify weak patterns contained in the identified regions of interest, the weak patterns being patterns deviating from the design by an amount greater than a threshold; validate the identified weak patterns; and report the validated weak patterns or facilitate revision of the design of the wafer based on the validated weak patterns.

公开(公告)号：US20160123898A1

公开(公告)日：2016-05-05

申请号：US14931226

申请日：2015-11-03

Applicant: KLA-Tencor Corporation

Inventor： Hong Chen ,  Kenong Wu ,  Martin Plihal ,  Vidur Pandita ,  Ravikumar Sanapala ,  Vivek Bhagat ,  Rahul Lakhawat ,  Oksen Baris ,  Rajesh Ramachandran ,  Naoshin Haque

IPC: G01N21/95

CPC classification number: H01J37/28 ,  G01N21/8851 ,  G01N21/9501 ,  G01N2021/8854 ,  G01N2021/8883 ,  G03F7/70625 ,  G03F7/7065 ,  H01J2237/24592

Abstract: Systems and methods for discovering defects on a wafer are provided. One method includes detecting defects on a wafer by applying a threshold to output generated by a detector in a first scan of the wafer and determining values for features of the detected defects. The method also includes automatically ranking the features, identifying feature cut-lines to group the defect into bins, and, for each of the bins, determining one or more parameters that if applied to the values for the features of the defects in each of the bins will result in a predetermined number of the defects in each of the bins. The method also includes applying the one or more determined parameters to the output generated by the detector in a second scan of the wafer to generate a defect population that has a predetermined defect count and is diversified in the values for the features.

Abstract translation: 提供了发现晶片缺陷的系统和方法。 一种方法包括通过在晶片的第一次扫描中施加由检测器产生的输出的阈值来检测晶片上的缺陷，并确定检测到的缺陷的特征的值。 该方法还包括对特征进行自动排序，识别特征切割线以将缺陷分组成箱，并且对于每个箱，确定一个或多个参数，如果应用于每个中的缺陷的特征的值 箱将导致每个箱中预定数量的缺陷。 该方法还包括将一个或多个确定的参数应用于在晶片的第二次扫描中由检测器产生的输出，以产生具有预定缺陷计数并且在特征值中多样化的缺陷群体。

公开(公告)号：US20170309009A1

公开(公告)日：2017-10-26

申请号：US15275726

申请日：2016-09-26

Applicant: KLA-Tencor Corporation

Inventor： Naoshin Haque ,  Allen Park ,  Ajay Gupta

IPC: G06T7/00

CPC classification number: G06T7/0004 ,  G06T2207/10061 ,  G06T2207/30148 ,  H01L22/12 ,  H01L22/20

Abstract: Methods and systems for providing weak pattern (or hotspot) detection and quantification are disclosed. A weak pattern detection and quantification system may include a wafer inspection tool configured to inspect a wafer and detect defects present on the wafer. The system may also include at least one processor in communication with the wafer inspection tool. The at least one processor may be configured to: perform pattern grouping on the detected defects based on design of the wafer; identify regions of interest based on the pattern grouping; identify weak patterns contained in the regions of interest identified, the weak patterns being patterns deviating from the design by an amount greater than a threshold; validate the weak patterns identified; and report the validated weak patterns or facilitate revision of the design of the wafer based on the validated weak patterns.

公开(公告)号：US20170076911A1

公开(公告)日：2017-03-16

申请号：US15359589

申请日：2016-11-22

Applicant: KLA-Tencor Corporation

Inventor： Hong Chen ,  Kenong Wu ,  Martin Plihal ,  Vidur Pandita ,  Ravikumar Sanapala ,  Vivek Bhagat ,  Rahul Lakhawat ,  Oksen Baris ,  Rajesh Ramachandran ,  Naoshin Haque

IPC: H01J37/28

CPC classification number: H01J37/28 ,  G01N21/8851 ,  G01N21/9501 ,  G01N2021/8854 ,  G01N2021/8883 ,  G03F7/70625 ,  G03F7/7065 ,  H01J2237/24592

Abstract: Systems and methods for discovering defects on a wafer are provided. One method includes detecting defects on a wafer by applying a threshold to output generated by a detector in a first scan of the wafer and determining values for features of the detected defects. The method also includes automatically ranking the features, identifying feature cut-lines to group the defect into bins, and, for each of the bins, determining one or more parameters that if applied to the values for the features of the defects in each of the bins will result in a predetermined number of the defects in each of the bins. The method also includes applying the one or more determined parameters to the output generated by the detector in a second scan of the wafer to generate a defect population that has a predetermined defect count and is diversified in the values for the features.

Abstract translation: 提供了发现晶片缺陷的系统和方法。 一种方法包括通过在晶片的第一次扫描中施加由检测器产生的输出的阈值来检测晶片上的缺陷，并确定检测到的缺陷的特征的值。 该方法还包括对特征进行自动排序，识别特征切割线以将缺陷分组成箱，并且对于每个箱，确定一个或多个参数，如果应用于每个中的缺陷的特征的值 箱将导致每个箱中预定数量的缺陷。 该方法还包括将一个或多个确定的参数应用于在晶片的第二次扫描中由检测器产生的输出，以产生具有预定缺陷计数并且在特征值中多样化的缺陷群体。