Invention Application
- Patent Title: CONDUCTIVE RESIN COMPOSITION FOR MICROWAVE HEATING
- Patent Title (中): 导电树脂组合物微波加热
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Application No.: US14895225Application Date: 2014-05-29
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Publication No.: US20160133350A1Publication Date: 2016-05-12
- Inventor: Hiroshi UCHIDA , Shoichiro WAKABAYASHI , Masanao HARA , Jun DOU
- Applicant: SHOWA DENKO K.K.
- Applicant Address: JP Tokyo
- Assignee: SHOWA DENKO K.K.
- Current Assignee: SHOWA DENKO K.K.
- Current Assignee Address: JP Tokyo
- Priority: JP2013-116824 20130603
- International Application: PCT/JP2014/064277 WO 20140529
- Main IPC: H01B1/22
- IPC: H01B1/22 ; H01B13/00

Abstract:
Provided is a conductive resin composition for microwave heating capable of suppressing the generation of sparks when microwave heating is performed. A conductive resin composition for microwave heating comprising a non-carbonaceous conductive filler, a curable and insulating binder resin, and a carbonaceous material having a higher volume resistivity value than the non-carbonaceous conductive filler, the carbonaceous material having an aspect ratio of 20 or less, and the content of the carbonaceous material being 1 to 20 parts by mass, relative to the total of 100 parts by mass of the non-carbonaceous conductive filler and the curable and insulating binder resin. The carbonaceous material efficiently absorbs the microwave, and thus, when the microwave is irradiated to heat and cure the conductive resin composition, generation of sparks can be suppressed.
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