公开(公告)号：US20160133350A1

公开(公告)日：2016-05-12

申请号：US14895225

申请日：2014-05-29

申请人： SHOWA DENKO K.K.

发明人： Hiroshi UCHIDA ,  Shoichiro WAKABAYASHI ,  Masanao HARA ,  Jun DOU

IPC分类号： H01B1/22 ,  H01B13/00

摘要： Provided is a conductive resin composition for microwave heating capable of suppressing the generation of sparks when microwave heating is performed. A conductive resin composition for microwave heating comprising a non-carbonaceous conductive filler, a curable and insulating binder resin, and a carbonaceous material having a higher volume resistivity value than the non-carbonaceous conductive filler, the carbonaceous material having an aspect ratio of 20 or less, and the content of the carbonaceous material being 1 to 20 parts by mass, relative to the total of 100 parts by mass of the non-carbonaceous conductive filler and the curable and insulating binder resin. The carbonaceous material efficiently absorbs the microwave, and thus, when the microwave is irradiated to heat and cure the conductive resin composition, generation of sparks can be suppressed.

摘要翻译： 提供一种用于微波加热的导电树脂组合物，其能够在进行微波加热时抑制火花的产生。 一种用于微波加热的导电树脂组合物，包括非碳质导电填料，可固化绝缘粘合剂树脂和具有比非碳质导电填料高的体积电阻率值的碳质材料，该碳质材料的纵横比为20或 相对于总计100质量份的非碳质导电填料和可固化绝缘粘合剂树脂，含碳材料的含量为1〜20质量份。 碳质材料有效地吸收微波，因此当照射微波加热固化导电树脂组合物时，可以抑制火花的产生。

公开(公告)号：US20160251531A1

公开(公告)日：2016-09-01

申请号：US15032388

申请日：2014-10-28

申请人： SHOWA DENKO K.K.

发明人： Hiroshi UCHIDA ,  Shoichiro WAKABAYASHI ,  Jun DOU ,  Takahiko ONO ,  Masumi KURITANI

IPC分类号： C09D11/52 ,  H05K3/12 ,  H05K1/09 ,  C09D11/037 ,  H01B1/02

CPC分类号： C09D11/52 ,  B41F15/00 ,  C09D11/037 ,  C09D11/10 ,  H01B1/02 ,  H01B1/22 ,  H05K1/092 ,  H05K3/1216 ,  H05K3/1291 ,  H05K2201/0245

摘要： Provided are a conductive composition for thin film printing and a method for forming a thin film conductive pattern, which can easily performing thin film printing, and can capable of improve conductivity by thermal sintering at a comparatively low temperature of 300° C. or less or by photo irradiation. A conductive composition comprises metal particles, a binder resin, and a solvent, the content of an organic compound in the solvent being 5 to 98% by mass, the organic compound comprising a hydrocarbon group having a bridged cyclic structure and a hydroxyl group, the content of metal particles being 15 to 60% by mass, the metal particles containing 20% by mass or more of flat metal particles, the content of the binder resin being 0.5 to 10 parts by mass relative to 100 parts by mass of the metal particles, and the viscosity at 25° C. being 1.0×103 to 2×105 mPa·s. The composition is printed in a pattern having any selected shape on a substrate, by screen printing, and the pattern is subjected to thermal sintering at a temperature of 300° C. or less and/or subjecting the pattern to pulsed light irradiation.

摘要翻译： 提供一种用于薄膜印刷的导电组合物和形成薄膜导电图案的方法，其可以容易地进行薄膜印刷，并且能够在300℃或更低的较低温度下通过热烧结提高导电性， 通过光照照射。 导电性组合物包含金属颗粒，粘合剂树脂和溶剂，溶剂中有机化合物的含量为5〜98质量％，所述有机化合物包含具有桥连环状结构和羟基的烃基， 金属粒子的含量为15〜60质量％，金属粒子含有20质量％以上的平坦金属粒子，粘合剂树脂的含量相对于100质量份的金属粒子为0.5〜10质量份 ，25℃下的粘度为1.0×10 3〜2×10 5 mPa·s。 通过丝网印刷将组合物印刷在基板上具有任何选定形状的图案，并且在300℃或更低的温度下对图案进行热烧结和/或使图案经受脉冲光照射。

公开(公告)号：US20160177357A1

公开(公告)日：2016-06-23

申请号：US14893114

申请日：2014-03-28

申请人： SHOWA DENKO K.K.

发明人： Ichiro FUJITA ,  Shoichiro WAKABAYASHI ,  Shinji YAMAKI ,  Tadashi YONEDA

IPC分类号： C12P19/14 ,  C08B1/00 ,  C12P19/02

CPC分类号： C12P19/14 ,  C08B1/00 ,  C08H8/00 ,  C12P19/02 ,  C12P2201/00 ,  C13K1/02

摘要： A pretreatment method for producing sugar from a cellulose-containing biomass, which includes subjecting the cellulose-containing biomass to hydrothermal treatment while fluidizing the cellulose-containing biomass; a production method of a biomass composition for saccharification use, including the pretreatment method; and a method for producing sugar, which includes hydrolyzing the biomass composition for saccharification use obtained by the above-mentioned production method.

摘要翻译： 一种用于从含纤维素生物质生产糖的预处理方法，其包括在含纤维素的生物质流化的同时对含纤维素的生物质进行水热处理; 包括预处理方法的用于糖化生物质组合物的生产方法; 和糖的制造方法，其包括水解通过上述制造方法得到的糖化用生物质组合物。