Invention Application
- Patent Title: Polishing Composition and Polishing Method
- Patent Title (中): 抛光组合和抛光方法
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Application No.: US15004424Application Date: 2016-01-22
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Publication No.: US20160136784A1Publication Date: 2016-05-19
- Inventor: Tatsuhiko HIRANO , Shuichi TAMADA , Takahiro UMEDA
- Applicant: Fujimi Incorporated
- Applicant Address: JP Kiyosu-shi
- Assignee: Fujimi Incorporated
- Current Assignee: Fujimi Incorporated
- Current Assignee Address: JP Kiyosu-shi
- Priority: JP2010-089698 20100408
- Main IPC: B24C1/08
- IPC: B24C1/08 ; C23F3/06 ; C09G1/18 ; H01L21/02 ; C09G1/16 ; C09G1/02
Abstract:
A polishing composition contains a polishing accelerator, a water-soluble polymer including a constitutional unit originating from a polymerizable compound having a guanidine structure such as dicyandiamide, and an oxidant. The water-soluble polymer may be a water-soluble polymer including a constitutional unit originating from dicyandiamide and a constitutional unit originating from formaldehyde, a diamine or a polyamine.
Information query
