A removable, permanent or reconfigurable debug probing device for use in debug probing of a printed circuit assembly, the printed circuit assembly having at least one through via, the debug probing device comprising at least one leader thread configured to be threaded through the at least one through via. Using the probing device comprises inserting a selected one of the at least one leader threads through a selected one of the at least one through via to thereby probe a surface of the printed circuit assembly; and responsive to detecting a defect in the selected through via, using a flexible circuit connected to the selected leader thread to repair the detected defect.