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公开(公告)号:US11765825B2
公开(公告)日:2023-09-19
申请号:US16238375
申请日:2019-01-02
Applicant: International Business Machines Corporation
Inventor: Matthew S. Doyle , Joseph Kuczynski , Timothy J. Tofil
CPC classification number: H05K1/0366 , C08J5/04 , C08K7/14 , H05K1/024 , H05K1/0248 , H05K2203/085
Abstract: In an example, an article of manufacture includes a composite material. The composite material includes hollow glass filaments that are encapsulated within a polymeric matrix material. The hollow glass filaments are at least partially filled with the polymeric matrix material.
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公开(公告)号:US11235625B2
公开(公告)日:2022-02-01
申请号:US16173304
申请日:2018-10-29
Applicant: International Business Machines Corporation
Inventor: Matthew S. Doyle , Layne A. Berge , Jason J. Bjorgaard , John R. Dangler , Thomas W. Liang , Manuel Orozco
Abstract: A method, system and computer program product are provided for implementing tire tread depth and wear patterns monitoring. A radio frequency identification (RFID) tag is provided with an associated tire to be monitored. A dipole antenna structure is coupled to the RFID tag and routed within a position in the tire tread and routed substantially circumferentially in the associated tire. A resonant frequency of the dipole antenna structure is detected to monitor tire tread wear.
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公开(公告)号:US10715337B2
公开(公告)日:2020-07-14
申请号:US15810464
申请日:2017-11-13
Applicant: International Business Machines Corporation
Inventor: Gerald K. Bartley , Darryl J. Becker , Matthew S. Doyle , Mark J. Jeanson , Mark O. Maxson
Abstract: A conductor on glass security layer may be located within a printed circuit board (PCB) of a crypto adapter card or within a daughter card upon the crypto adapter card. The conductor on glass security layer includes a glass dielectric layer that remains intact in the absence of point force loading and shatters when a point load punctures or otherwise contacts the glass dielectric layer. The conductor on glass security layer also includes a conductive security trace upon the glass dielectric layer. A physical access attempt shatters a majority of the glass dielectric layer, which in turn fractures the security trace. A monitoring circuit that monitors the resistance of the conductive security trace detects the resultant open circuit or change in security trace resistance and initiates a tamper signal that which may be received by one or more computer system devices to respond to the unauthorized attempt of physical access.
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公开(公告)号:US10559902B2
公开(公告)日:2020-02-11
申请号:US14987624
申请日:2016-01-04
Applicant: International Business Machines Corporation
Inventor: Gerald K. Bartley , Darryl J. Becker , Matthew S. Doyle , Mark J. Jeanson , Mark O. Maxson
Abstract: Disclosed aspects relate to connector structures and a card. A first connector structure is to join a first subset of a set of electrical connections. A second connector structure is to join a second subset of the set of electrical connections. The card manages the set of electrical connections and is located between the first and second connector structures to connect with the first and second connector structures.
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公开(公告)号:US10547640B1
公开(公告)日:2020-01-28
申请号:US16210615
申请日:2018-12-05
Applicant: International Business Machines Corporation
Inventor: Gerald K. Bartley , Darryl J. Becker , Matthew S. Doyle , Joseph Kuczynski , Timothy J. Tofil
Abstract: A security matrix layer between a first and second conductive shorting layers are located within a printed circuit board (PCB). The security matrix layer includes at least two types of microcapsules with each type of microcapsule containing a different reactant. When the security matrix layer is accessed, drilled, or otherwise damaged, the microcapsules rupture and the reactants react to form at least an electrically conductive material. The electrically conductive material may contact and short the first and second conductive shorting layers.
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公开(公告)号:US20190386414A1
公开(公告)日:2019-12-19
申请号:US16554962
申请日:2019-08-29
Applicant: International Business Machines Corporation
Inventor: Gerald K. Bartley , Darryl J. Becker , Matthew S. Doyle , Mark J. Jeanson , Mark O. Maxson
IPC: H01R12/73
Abstract: Disclosed aspects relate to connector structures and a card. A first connector structure is to join a first subset of a set of electrical connections. A second connector structure is to join a second subset of the set of electrical connections. The card manages the set of electrical connections and is located between the first and second connector structures to connect with the first and second connector structures.
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公开(公告)号:US20190278947A1
公开(公告)日:2019-09-12
申请号:US16426759
申请日:2019-05-30
Applicant: International Business Machines Corporation
Inventor: Layne A. Berge , John R. Dangler , Matthew S. Doyle , Thomas W. Liang , Manuel Orozco
Abstract: An optical electromagnetic radiation (EM) emitter and receiver are located upon a printed circuit board (PCB) layer and are connected to an optical security pathway. A predetermined reference flux is determined, the reference flux being the expected EM transmitted by the optical security pathway and received by the receiver. When the PCB is subject to an unauthorized access thereof (e.g., drilled, sawed, cut, etc.), the optical EM transferred by optical security pathway is altered. An optical monitoring device that monitors the flux of the optical EM received by the receiver detects a change in flux, in relation to the reference flux, and passes a tamper signal to one or more computer system devices to respond to the unauthorized access. For example, one or more cryptographic adapter card or computer system functions or secured crypto components may be disabled.
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公开(公告)号:US10383216B2
公开(公告)日:2019-08-13
申请号:US14828796
申请日:2015-08-18
Applicant: International Business Machines Corporation
Inventor: Matthew S. Doyle , Joseph Kuczynski , Kevin M. O'Connell , Chelsie M. Peterson , Mark D. Plucinski , Timothy J. Tofil
Abstract: In an example, a process includes forming a patterned layer on a polymer substrate. The process also includes depositing a graphene-containing material on the patterned layer to form a plurality of graphene traces of a tamper detection circuit.
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公开(公告)号:US10303639B2
公开(公告)日:2019-05-28
申请号:US15862104
申请日:2018-01-04
Applicant: International Business Machines Corporation
Inventor: Gerald K. Bartley , Darryl J. Becker , Matthew S. Doyle , Mark J. Jeanson , Mark O. Maxson
Abstract: A method of fabricating a printed circuit board (PCB) is presented. The PCB includes a glass security layer. The method includes forming the glass security layer upon a PCB wiring layer. The method includes optically attaching an optical electromagnetic radiation (EM) emitter upon the glass security layer. The method includes optically attaching an optical EM receiver upon the glass security layer. The method further includes electrically connecting an optical monitor device to the optical EM receiver.
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公开(公告)号:US10076045B2
公开(公告)日:2018-09-11
申请号:US15722519
申请日:2017-10-02
Applicant: International Business Machines Corporation
Inventor: Matthew S. Doyle , Joseph Kuczynski , Phillip V. Mann , Kevin M. O'Connell
CPC classification number: H05K3/425 , H05K1/034 , H05K1/115 , H05K3/423 , H05K2201/015 , H05K2203/143
Abstract: A method and structure are provided for implementing enhanced via creation without creating a via barrel stub. The need to backdrill vias during printed circuit board (PCB) manufacturing is eliminated. After the vias have been drilled, but before plating, a plug is inserted into each via and the plug is lowered to a depth just below a desired signal trace layer. A thin anti-electroplate coating is applied onto the walls of the via below the signal trace. Then the plugs are removed and a standard board plating process for the PCB is performed.
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