Invention Application
- Patent Title: MOLDING RESIN COMPOSITION
- Patent Title (中): 模塑树脂组合物
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Application No.: US14392197Application Date: 2014-06-23
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Publication No.: US20160160044A1Publication Date: 2016-06-09
- Inventor: Hirotaka KANAYA , Kuniaki KAWABE , Masakazu TANAKA
- Applicant: MITSUI CHEMICALS, INC.
- Applicant Address: JP Tokyo
- Assignee: Mitsui Chemicals. Inc.
- Current Assignee: Mitsui Chemicals. Inc.
- Current Assignee Address: JP Tokyo
- Priority: JP2013-136544 20130628; JP2013-226262 20131031
- International Application: PCT/JP2014/003349 WO 20140623
- Main IPC: C08L69/00
- IPC: C08L69/00 ; C08J3/22

Abstract:
Problem to be solved by the present invention is to provide a molding resin composition containing an inorganic reinforcing material which enables a molded body having excellent impact resistance, high surface glossiness, and good mold releasability. This problem is solved by a molding resin composition comprising: 94 to 49 parts by weight of at least one resin (A) selected from a thermoplastic resin and a thermosetting resin; 5 to 50 parts by weight of an inorganic reinforcing material (B); 1 to 46 parts by weight of a functional group-containing olefin polymer (C) containing a component having a Tg of −140° C. to 0° C. (total of the components (A), (B) and (C) being 100 parts by weight), and 0.01 to 10 parts by weight of an olefin wax (D) having an oxygen- or nitrogen-containing group, the weight ratio C/D of component C to component D being 0.1 to 30.
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