RESIN COMPOSITION FOR FORMING OPTICAL COMPONENT, MOLDED PRODUCT, AND OPTICAL COMPONENT

    公开(公告)号:US20240352227A1

    公开(公告)日:2024-10-24

    申请号:US18686481

    申请日:2022-11-28

    IPC分类号: C08K5/3417 G02B1/04

    CPC分类号: C08K5/3417 G02B1/041

    摘要: A resin composition for forming an optical component contains (A) a cyclic olefin-based polymer and (B) one or a plurality of coloring agents. The cyclic olefin-based polymer (A) includes at least one selected from a copolymer of ethylene or an α-olefin with a cyclic olefin, and a ring-opening polymer of a cyclic olefin. A molded product having a thickness at which transmittance of light having a wavelength of 700 nm is 30%, which is formed of the resin composition, satisfies all of the following conditions (1) to (3): (1) an average value of transmittance at a wavelength of 300 to 400 nm is equal to or less than 40%, (2) an average value of transmittance at a wavelength of 500 to 600 nm is equal to or more than 70%, and (3) transmittance at a wavelength of 650 nm is equal to or more than 60%.

    POLYAMIDE RESIN COMPOSITION AND POLYAMIDE MOLDED ARTICLE

    公开(公告)号:US20240228740A9

    公开(公告)日:2024-07-11

    申请号:US18547555

    申请日:2022-03-16

    IPC分类号: C08K3/105 C08G69/26

    CPC分类号: C08K3/105 C08G69/265

    摘要: Provided is a polyamide resin composition that, at high temperatures, suppresses reductions in tensile strength due to the addition of a copper-based heat-resistance stabilizer, and maintains a tensile strength over longer periods of time in a hot environment. The composition includes a polyamide resin and a copper-based heat-resistance stabilizer. The polyamide resin includes: a component unit (a) derived from dicarboxylic acid which is derived from an aromatic dicarboxylic acid or an alicyclic dicarboxylic acid; and greater than or equal to 10 mol % and less than 50 mol % of a component unit (b2), which is derived from 1,3-bis(aminomethyl)cyclohexane, with respect to the total number of moles of a component unit (b) derived from diamine. The content of copper included in the copper-based heat-resistance stabilizer is 0.001 parts by mass to 0.050 parts by mass, inclusive, with respect to 100 total parts by mass of the polyamide resin.

    POLYAMIC ACID COMPOSITION, POLYIMIDE COMPOSITION, ADHESIVE AND LAMINATE

    公开(公告)号:US20240182765A1

    公开(公告)日:2024-06-06

    申请号:US18551460

    申请日:2022-03-11

    IPC分类号: C09J179/08 C08G73/10

    摘要: The polyamic acid composition according to the present disclosure comprises a polyamic acid. The monomers constituting the polyamic acid include, relative to the total monomers, 30-95 mol % of monomer (A) that has a diphenyl ether skeleton represented by general formula (1) or (2) but no benzophenone skeleton, and 0-5 mol % of monomer (B) that has a benzophenone skeleton. The diamines constituting the polyamic acid include aromatic diamine (β1) that has a diphenyl ether skeleton represented by general formula (2) and aliphatic diamine (β2) represented by general formula (3) or (4), and the molar ratio b/a of the diamines b to tetracarboxylic dianhydride a constituting the polyamic acid is 0.90-0.999.