Invention Application
- Patent Title: ELECTRONIC APPARATUS
- Patent Title (中): 电子设备
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Application No.: US14900651Application Date: 2014-06-24
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Publication No.: US20160163613A1Publication Date: 2016-06-09
- Inventor: Shinya UCHIBORI , Norihisa IMAIZUMI , Masayuki TAKENAKA
- Applicant: DENSO CORPORATION
- Priority: JP2013-136900 20130628; JP2014-105060 20140521
- International Application: PCT/JP2014/003376 WO 20140624
- Main IPC: H01L23/31
- IPC: H01L23/31 ; H05K1/18 ; H01L23/498
Abstract:
An electronic apparatus includes a board, a first electronic component, a mold resin and a second electronic component. The board has a first surface and a second surface opposite to the first surface. The first electronic component is mounted on the first surface of the board. The mold resin seals the first electronic component and the first surface of the board. The second electronic component is arranged on the mold resin.
Information query
IPC分类:
