公开(公告)号：US20160163613A1

公开(公告)日：2016-06-09

申请号：US14900651

申请日：2014-06-24

Applicant: DENSO CORPORATION

Inventor： Shinya UCHIBORI ,  Norihisa IMAIZUMI ,  Masayuki TAKENAKA

IPC: H01L23/31 ,  H05K1/18 ,  H01L23/498

CPC classification number: H01L23/3157 ,  H01L23/3121 ,  H01L23/49811 ,  H01L23/49827 ,  H01L24/73 ,  H01L25/16 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H05K1/181 ,  H05K3/284 ,  H05K3/301 ,  H05K3/3415 ,  H05K2201/09436 ,  H05K2201/10462 ,  H05K2201/10515 ,  H05K2201/10537 ,  H05K2201/10583 ,  H05K2201/10757 ,  H05K2201/2036 ,  H01L2924/00012 ,  H01L2924/00

Abstract: An electronic apparatus includes a board, a first electronic component, a mold resin and a second electronic component. The board has a first surface and a second surface opposite to the first surface. The first electronic component is mounted on the first surface of the board. The mold resin seals the first electronic component and the first surface of the board. The second electronic component is arranged on the mold resin.

Abstract translation: 电子设备包括板，第一电子部件，模具树脂和第二电子部件。 板具有与第一表面相对的第一表面和第二表面。 第一电子部件安装在板的第一表面上。 模具树脂密封第一电子部件和板的第一表面。 第二电子部件布置在模制树脂上。

公开(公告)号：US20150319840A1

公开(公告)日：2015-11-05

申请号：US14427458

申请日：2013-09-24

Applicant: DENSO CORPORATION

Inventor： Yuuki SANADA ,  Norihisa IMAIZUMI ,  Shinya UCHIBORI ,  Masaji IMADA ,  Toshihiro NAKAMURA ,  Eiji YABUTA ,  Masayuki TAKENAKA

IPC: H05K1/02 ,  H05K1/18

CPC classification number: H05K1/0204 ,  H01L23/13 ,  H01L23/367 ,  H01L23/3677 ,  H01L23/3735 ,  H01L2224/32225 ,  H01L2924/13055 ,  H01L2924/19105 ,  H05K1/0206 ,  H05K1/0209 ,  H05K1/181 ,  H05K1/182 ,  H05K7/205 ,  H05K7/20854 ,  H05K2201/09781 ,  H05K2201/10166 ,  H01L2924/00

Abstract: In an electronic device, a heat generating element is connected directly to an electrically-conductive joining material that is the start point of the heat dissipation path on the one surface of the substrate, and the other surface of the substrate is provided by an other surface side insulating layer. An electrically-conductive other surface side electrode connected to an external heat dissipation member is disposed on the surface of the other surface side insulating layer right under the heat generating element. On the other surface side of the substrate, an other surface side inner layer wire that is the end point of the heat dissipation path extends to the other surface side insulating layer and is insulated electrically from the other surface side electrode through the other surface side insulating layer.

Abstract translation: 在电子设备中，发热元件直接连接到作为基板的一个表面上的散热路径的起始点的导电接合材料，并且基板的另一个表面由另一个表面 侧绝缘层。 连接到外部散热构件的导电的另一表面侧电极设置在发热元件正下方的另一表面侧绝缘层的表面上。 在基板的另一面侧，作为散热路径的端点的另一面侧内层线延伸到另一表面侧绝缘层，并且通过另一表面侧绝缘而与另一表面侧电极电绝缘 层。

公开(公告)号：US20160104653A1

公开(公告)日：2016-04-14

申请号：US14894637

申请日：2014-06-03

Applicant: DENSO CORPORATION

Inventor： Norihisa IMAIZUMI ,  Yuuki SANADA ,  Masayuki TAKENAKA ,  Shinya UCHIBORI ,  Kengo OKA ,  Tasuke FUKUDA ,  Keitarou NAKAMA

IPC: H01L23/31 ,  H01L23/498

CPC classification number: H01L23/3121 ,  H01L21/561 ,  H01L23/49838 ,  H01L24/97 ,  H01L25/00 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/00

Abstract: In a substrate, at least one lateral surface between one surface and another surface is a cut surface that is cut together with mold resin. The mold resin, which is cut together with the substrate, is provided with a surface that is flush with the cut surface. A portion of the mold resin constituting the surface flush with the cut surface has a surface that is joined to the surface flush with the cut surface and parallel to the one surface of the substrate; this portion is thinner than a portion that seals electronic parts. Consequently, the mold resin is cut with a dicing blade brought into contact with a surface parallel to the one surface of the substrate.

Abstract translation: 在基材中，一个表面和另一个表面之间的至少一个侧面是与模制树脂一起切割的切割表面。 与基板一起切割的模制树脂设置有与切割表面齐平的表面。 构成与切割表面齐平的表面的模制树脂的一部分具有与切割面平齐且平行于基板的一个表面的表面接合的表面; 该部分比密封电子部件的部分薄。 因此，用与基板的一个表面平行的表面接触的切割刀片切割模制树脂。

公开(公告)号：US20140217620A1

公开(公告)日：2014-08-07

申请号：US14248406

申请日：2014-04-09

Applicant: DENSO CORPORATION

Inventor： Tetsuto YAMAGISHI ,  Tohru NOMURA ,  Norihisa IMAIZUMI ,  Yasutomi ASAI

IPC: H01L23/00

CPC classification number: H01L24/83 ,  H01L21/4807 ,  H01L23/13 ,  H01L23/15 ,  H01L23/315 ,  H01L23/3677 ,  H01L23/4334 ,  H01L23/49506 ,  H01L23/49531 ,  H01L23/49822 ,  H01L23/50 ,  H01L23/562 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/1461 ,  H01L2924/15192 ,  H01L2924/15747 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19015 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

Abstract: An electronic device includes: a substrate having first and second surfaces, wherein the first surface is opposite to the second surface; a first electronic element mounted on the first surface of the substrate; a second electronic element mounted on the second surface of the substrate; and a resin mold sealing the first electronic element and the first surface of the substrate. The resin mold further seals the second electronic element on the second surface of the substrate. The second surface of the substrate has a portion, which is exposed from the resin mold. The second electronic element is not disposed on the portion of the second surface.

Abstract translation: 电子设备包括：具有第一和第二表面的基底，其中第一表面与第二表面相对; 安装在所述基板的第一表面上的第一电子元件; 安装在所述基板的第二表面上的第二电子元件; 以及密封第一电子元件和基板的第一表面的树脂模具。 树脂模具进一步密封基板的第二表面上的第二电子元件。 基板的第二表面具有从树脂模露出的部分。 第二电子元件不设置在第二表面的部分上。

公开(公告)号：US20220115283A1

公开(公告)日：2022-04-14

申请号：US17559608

申请日：2021-12-22

Applicant: DENSO CORPORATION

Inventor： Akihiro YAMAGUCHI ,  Norihisa IMAIZUMI ,  Ryuma KAMIKOMAKI ,  Kouji KONDOH ,  Hirotaka MIYANO ,  Tomohiro YOKOCHI ,  Gentarou MASUDA

IPC: H01L23/29 ,  H01L21/56

Abstract: A semiconductor package includes a semiconductor chip, a heat radiating member on which the semiconductor chip is mounted, and a sealing member sealing the semiconductor chip. The sealing member is made of a liquid crystal polymer.

公开(公告)号：US20160150655A1

公开(公告)日：2016-05-26

申请号：US14898972

申请日：2014-06-17

Applicant: DENSO CORPORATION

Inventor： Masayuki TAKENAKA ,  Norihisa IMAIZUMI ,  Toshihiro NAKAMURA

IPC: H05K5/00 ,  H05K7/20 ,  H05K5/02 ,  H05K1/02 ,  H05K1/11

CPC classification number: H05K5/0004 ,  H01L2224/48091 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H05K1/0204 ,  H05K1/0209 ,  H05K1/0271 ,  H05K1/115 ,  H05K1/116 ,  H05K3/284 ,  H05K3/3447 ,  H05K5/0056 ,  H05K5/0247 ,  H05K7/20409 ,  H05K2201/066 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An electronic apparatus includes a board, an electronic component, a mold resin a rod-like connection terminal and a case. The board includes: a first surface; a second surface, which is opposite to the first surface; a wire pattern; and a through-hole having a metal member connected to the wire pattern. The electronic component mounted on the first surface of the board. The mold resin seals the electronic component on the first surface of the board. The rod-like connection terminal inserted into the through-hole from a distal end of the through-hole and electrically connected to the metal member. The case having a surface on which the connection terminal stands and accommodating the board on which the electronic component is mounted. The board is arranged such that the first surface on which the electronic component and the mold resin are arranged faces the surface of the case on which the connection terminal stands.

Abstract translation: 电子设备包括板，电子部件，模制树脂，棒状连接端子和壳体。 该板包括：第一表面; 第二表面，其与第一表面相对; 电线图案 以及具有与导线图形连接的金属构件的通孔。 电子部件安装在板的第一表面上。 模具树脂密封板的第一表面上的电子部件。 杆状连接端子从通孔的远端插入到通孔中并电连接到金属构件。 具有连接端子架在其上并容纳安装有电​​子部件的板的表面的壳体。 电路板布置成使得电子部件和模制树脂布置在其上的第一表面面对连接端子所在的壳体的表面。