公开(公告)号：US20160104653A1

公开(公告)日：2016-04-14

申请号：US14894637

申请日：2014-06-03

Applicant: DENSO CORPORATION

Inventor： Norihisa IMAIZUMI ,  Yuuki SANADA ,  Masayuki TAKENAKA ,  Shinya UCHIBORI ,  Kengo OKA ,  Tasuke FUKUDA ,  Keitarou NAKAMA

IPC: H01L23/31 ,  H01L23/498

CPC classification number: H01L23/3121 ,  H01L21/561 ,  H01L23/49838 ,  H01L24/97 ,  H01L25/00 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/00

Abstract: In a substrate, at least one lateral surface between one surface and another surface is a cut surface that is cut together with mold resin. The mold resin, which is cut together with the substrate, is provided with a surface that is flush with the cut surface. A portion of the mold resin constituting the surface flush with the cut surface has a surface that is joined to the surface flush with the cut surface and parallel to the one surface of the substrate; this portion is thinner than a portion that seals electronic parts. Consequently, the mold resin is cut with a dicing blade brought into contact with a surface parallel to the one surface of the substrate.

Abstract translation: 在基材中，一个表面和另一个表面之间的至少一个侧面是与模制树脂一起切割的切割表面。 与基板一起切割的模制树脂设置有与切割表面齐平的表面。 构成与切割表面齐平的表面的模制树脂的一部分具有与切割面平齐且平行于基板的一个表面的表面接合的表面; 该部分比密封电子部件的部分薄。 因此，用与基板的一个表面平行的表面接触的切割刀片切割模制树脂。

公开(公告)号：US20190244886A1

公开(公告)日：2019-08-08

申请号：US16385285

申请日：2019-04-16

Applicant: DENSO CORPORATION

Inventor： Kosuke SUZUKI ,  Atsushi KASHIWAZAKI ,  Yuki SANADA ,  Toshihiro NAKAMURA ,  Shinya UCHIBORI

IPC: H01L23/498 ,  H05K1/11

CPC classification number: H01L23/49838 ,  H01L23/28 ,  H01L23/31 ,  H01L23/49827 ,  H05K1/114 ,  H05K3/28 ,  H05K2201/09236 ,  H05K2201/0989 ,  H05K2201/099

Abstract: A solder resist is configured such that pattern covering portions of the solder resist covering straight portions of adjacent wiring patterns are separated from each other in an area outside of a resin mold part. Thus, even if the solder resist is cracked, cracks will not be formed so as to connect between the adjacent wiring patterns. As such, even if moisture generated by condensation or the like enters in the crack, it is less likely that a short circuit will occur between the adjacent wiring patterns.

公开(公告)号：US20160163613A1

公开(公告)日：2016-06-09

申请号：US14900651

申请日：2014-06-24

Applicant: DENSO CORPORATION

Inventor： Shinya UCHIBORI ,  Norihisa IMAIZUMI ,  Masayuki TAKENAKA

IPC: H01L23/31 ,  H05K1/18 ,  H01L23/498

CPC classification number: H01L23/3157 ,  H01L23/3121 ,  H01L23/49811 ,  H01L23/49827 ,  H01L24/73 ,  H01L25/16 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H05K1/181 ,  H05K3/284 ,  H05K3/301 ,  H05K3/3415 ,  H05K2201/09436 ,  H05K2201/10462 ,  H05K2201/10515 ,  H05K2201/10537 ,  H05K2201/10583 ,  H05K2201/10757 ,  H05K2201/2036 ,  H01L2924/00012 ,  H01L2924/00

Abstract: An electronic apparatus includes a board, a first electronic component, a mold resin and a second electronic component. The board has a first surface and a second surface opposite to the first surface. The first electronic component is mounted on the first surface of the board. The mold resin seals the first electronic component and the first surface of the board. The second electronic component is arranged on the mold resin.

Abstract translation: 电子设备包括板，第一电子部件，模具树脂和第二电子部件。 板具有与第一表面相对的第一表面和第二表面。 第一电子部件安装在板的第一表面上。 模具树脂密封第一电子部件和板的第一表面。 第二电子部件布置在模制树脂上。

公开(公告)号：US20160133539A1

公开(公告)日：2016-05-12

申请号：US14893987

申请日：2014-05-29

Applicant: DENSO CORPORATION

Inventor： Kengo OKA ,  Yuki SANADA ,  Masayuki TAKENAKA ,  Shinya UCHIBORI ,  Tasuke FUKUDA

IPC: H01L23/31 ,  H01L23/498 ,  H01L21/56

CPC classification number: H01L23/3121 ,  H01L21/565 ,  H01L23/3135 ,  H01L23/49838 ,  H01L2224/48091 ,  H01L2224/49175 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: A mold package includes a substrate having a first surface and a second surface disposed opposite to the first surface, a wiring part disposed on the first surface in protruded manner, a molding resin, and a resin film. The molding resin partially seals the first surface of the substrate and the wiring part and intersects with the wiring part. The resin film is disposed between the first surface of the substrate and the end of the molding resin, and seals the wiring part and the first surface of the substrate adjacent to the wiring part. The resin film includes a first portion disposed inside the molding resin and a second portion disposed outside the molding resin. An upper surface of the second portion is lower than an upper surface of the first portion and has less uneven portions than the upper surface of the first portion.

Abstract translation: 模具包装体包括具有第一表面和与第一表面相对设置的第二表面的基板，以突出方式布置在第一表面上的布线部分，模塑树脂和树脂膜。 模制树脂部分地密封基板的第一表面和布线部分，并与布线部分相交。 树脂膜设置在基板的第一表面和模制树脂的端部之间，并且密封布线部分和邻近布线部分的基板的第一表面。 树脂膜包括设置在模制树脂内部的第一部分和设置在模制树脂外部的第二部分。 第二部分的上表面比第一部分的上表面低，并且具有比第一部分的上表面少的凹凸部分。

公开(公告)号：US20160105958A1

公开(公告)日：2016-04-14

申请号：US14785422

申请日：2014-04-21

Applicant: DENSO CORPORATION

Inventor： Toshihiro NAKAMURA ,  Shinya UCHIBORI ,  Koji NUMAZAKI ,  Atsushi KASHIWAZAKI ,  Masaji IMADA ,  Eiji YABUTA

IPC: H05K1/03 ,  H05K3/00 ,  H05K3/06 ,  H05K3/34 ,  H01L23/498 ,  H05K1/18

CPC classification number: H05K1/0306 ,  H01L23/145 ,  H01L23/15 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/19105 ,  H05K1/0313 ,  H05K1/038 ,  H05K1/181 ,  H05K3/0067 ,  H05K3/067 ,  H05K3/341 ,  H05K3/427 ,  H05K3/4602 ,  H05K3/4655 ,  H05K2201/029 ,  H05K2201/0347 ,  H05K2201/09563 ,  H05K2201/0959 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/10166 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: In a multi-layer substrate, a glass cloth of a build-up layer is deformed toward a land below the land. A thickness of a resin layer of the build-up layer from the glass cloth to a surface adjacent to the land is set to be smaller than a dimension from the glass cloth to a front surface of a core layer. With the above configuration, a progress or an enlargement of a crack can be suppressed from a stage in which the crack is smaller. Therefore, the progress and the enlargement of the crack can be delayed. As a result, even if the crack is generated, an insulating property between the land and an inner layer wire is ensured, and the land and the inner layer wire can be restricted from being short-circuited.

Abstract translation: 在多层基板中，堆积层的玻璃布朝向陆地下方的陆地变形。 从玻璃布到邻接的台面的堆积层的树脂层的厚度被设定为小于从玻璃布到芯层的前表面的尺寸。 利用上述结构，可以从裂纹较小的阶段抑制裂纹的进行或扩大。 因此，破裂的进展和扩大可能会延迟。 结果，即使产生裂缝，也能够确保焊盘与内层电线之间的绝缘性，能够限制焊盘和内层电线的短路。

公开(公告)号：US20150319840A1

公开(公告)日：2015-11-05

申请号：US14427458

申请日：2013-09-24

Applicant: DENSO CORPORATION

Inventor： Yuuki SANADA ,  Norihisa IMAIZUMI ,  Shinya UCHIBORI ,  Masaji IMADA ,  Toshihiro NAKAMURA ,  Eiji YABUTA ,  Masayuki TAKENAKA

IPC: H05K1/02 ,  H05K1/18

CPC classification number: H05K1/0204 ,  H01L23/13 ,  H01L23/367 ,  H01L23/3677 ,  H01L23/3735 ,  H01L2224/32225 ,  H01L2924/13055 ,  H01L2924/19105 ,  H05K1/0206 ,  H05K1/0209 ,  H05K1/181 ,  H05K1/182 ,  H05K7/205 ,  H05K7/20854 ,  H05K2201/09781 ,  H05K2201/10166 ,  H01L2924/00

Abstract: In an electronic device, a heat generating element is connected directly to an electrically-conductive joining material that is the start point of the heat dissipation path on the one surface of the substrate, and the other surface of the substrate is provided by an other surface side insulating layer. An electrically-conductive other surface side electrode connected to an external heat dissipation member is disposed on the surface of the other surface side insulating layer right under the heat generating element. On the other surface side of the substrate, an other surface side inner layer wire that is the end point of the heat dissipation path extends to the other surface side insulating layer and is insulated electrically from the other surface side electrode through the other surface side insulating layer.

Abstract translation: 在电子设备中，发热元件直接连接到作为基板的一个表面上的散热路径的起始点的导电接合材料，并且基板的另一个表面由另一个表面 侧绝缘层。 连接到外部散热构件的导电的另一表面侧电极设置在发热元件正下方的另一表面侧绝缘层的表面上。 在基板的另一面侧，作为散热路径的端点的另一面侧内层线延伸到另一表面侧绝缘层，并且通过另一表面侧绝缘而与另一表面侧电极电绝缘 层。