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8 条记录 (耗时 0.015 秒)

    ELECTRONIC APPARATUS
    3.
    发明申请
    ELECTRONIC APPARATUS 审中-公开
    电子设备

    公开(公告)号：US20160150655A1

    公开(公告)日：2016-05-26

    申请号：US14898972

    申请日：2014-06-17

    申请人： DENSO CORPORATION

    发明人： Masayuki TAKENAKA ,  Norihisa IMAIZUMI ,  Toshihiro NAKAMURA

    IPC分类号： H05K5/00 ,  H05K7/20 ,  H05K5/02 ,  H05K1/02 ,  H05K1/11

    CPC分类号： H05K5/0004 ,  H01L2224/48091 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H05K1/0204 ,  H05K1/0209 ,  H05K1/0271 ,  H05K1/115 ,  H05K1/116 ,  H05K3/284 ,  H05K3/3447 ,  H05K5/0056 ,  H05K5/0247 ,  H05K7/20409 ,  H05K2201/066 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00

    摘要： An electronic apparatus includes a board, an electronic component, a mold resin a rod-like connection terminal and a case. The board includes: a first surface; a second surface, which is opposite to the first surface; a wire pattern; and a through-hole having a metal member connected to the wire pattern. The electronic component mounted on the first surface of the board. The mold resin seals the electronic component on the first surface of the board. The rod-like connection terminal inserted into the through-hole from a distal end of the through-hole and electrically connected to the metal member. The case having a surface on which the connection terminal stands and accommodating the board on which the electronic component is mounted. The board is arranged such that the first surface on which the electronic component and the mold resin are arranged faces the surface of the case on which the connection terminal stands.

    摘要翻译： 电子设备包括板，电子部件，模制树脂，棒状连接端子和壳体。 该板包括：第一表面; 第二表面，其与第一表面相对; 电线图案 以及具有与导线图形连接的金属构件的通孔。 电子部件安装在板的第一表面上。 模具树脂密封板的第一表面上的电子部件。 杆状连接端子从通孔的远端插入到通孔中并电连接到金属构件。 具有连接端子架在其上并容纳安装有电​​子部件的板的表面的壳体。 电路板布置成使得电子部件和模制树脂布置在其上的第一表面面对连接端子所在的壳体的表面。

    SEMICONDUCTOR MODULE AND SEMICONDUCTOR DEVICE USED THEREFOR
    4.
    发明申请
    SEMICONDUCTOR MODULE AND SEMICONDUCTOR DEVICE USED THEREFOR 有权

    公开(公告)号：US20220005743A1

    公开(公告)日：2022-01-06

    申请号：US17476326

    申请日：2021-09-15

    申请人： DENSO CORPORATION

    发明人： Seigo OSAWA ,  Yasushi OKURA ,  Takahiro NAKANO ,  Naohito MIZUNO ,  Masayuki TAKENAKA ,  Yoshihiro INUTSUKA

    IPC分类号： H01L23/367 ,  H01L23/31 ,  H01L23/495

    摘要： A semiconductor module includes a first heat sink member, a semiconductor device, a second heat sink member, a lead frame, a second sealing member. The semiconductor device includes a semiconductor element, a first sealing member for covering the semiconductor element, a first wiring and a second wiring electrically connected to the semiconductor element, and a rewiring layer on the semiconductor element and the sealing member. The second heat sink member is disposed on the semiconductor device. The lead frame is electrically connected to the semiconductor device through a bonding member. The second sealing member covers a portion of the first heat sink member, the semiconductor and a portion of the second heat sink member. A surface of the second heat sink member faces the semiconductor device. The semiconductor device has a portion protruded from an outline of the second surface sink member.

    MOLD PACKAGE AND MANUFACTURING METHOD THEREOF
    7.
    发明申请
    MOLD PACKAGE AND MANUFACTURING METHOD THEREOF 有权
    模具包装及其制造方法

    公开(公告)号：US20160133539A1

    公开(公告)日：2016-05-12

    申请号：US14893987

    申请日：2014-05-29

    申请人： DENSO CORPORATION

    发明人： Kengo OKA ,  Yuki SANADA ,  Masayuki TAKENAKA ,  Shinya UCHIBORI ,  Tasuke FUKUDA

    IPC分类号： H01L23/31 ,  H01L23/498 ,  H01L21/56

    CPC分类号： H01L23/3121 ,  H01L21/565 ,  H01L23/3135 ,  H01L23/49838 ,  H01L2224/48091 ,  H01L2224/49175 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/00014 ,  H01L2924/00012

    摘要： A mold package includes a substrate having a first surface and a second surface disposed opposite to the first surface, a wiring part disposed on the first surface in protruded manner, a molding resin, and a resin film. The molding resin partially seals the first surface of the substrate and the wiring part and intersects with the wiring part. The resin film is disposed between the first surface of the substrate and the end of the molding resin, and seals the wiring part and the first surface of the substrate adjacent to the wiring part. The resin film includes a first portion disposed inside the molding resin and a second portion disposed outside the molding resin. An upper surface of the second portion is lower than an upper surface of the first portion and has less uneven portions than the upper surface of the first portion.

    摘要翻译： 模具包装体包括具有第一表面和与第一表面相对设置的第二表面的基板，以突出方式布置在第一表面上的布线部分，模塑树脂和树脂膜。 模制树脂部分地密封基板的第一表面和布线部分，并与布线部分相交。 树脂膜设置在基板的第一表面和模制树脂的端部之间，并且密封布线部分和邻近布线部分的基板的第一表面。 树脂膜包括设置在模制树脂内部的第一部分和设置在模制树脂外部的第二部分。 第二部分的上表面比第一部分的上表面低，并且具有比第一部分的上表面少的凹凸部分。

    ELECTRONIC DEVICE
    8.
    发明申请
    ELECTRONIC DEVICE 有权
    电子设备

    公开(公告)号：US20150319840A1

    公开(公告)日：2015-11-05

    申请号：US14427458

    申请日：2013-09-24

    申请人： DENSO CORPORATION

    发明人： Yuuki SANADA ,  Norihisa IMAIZUMI ,  Shinya UCHIBORI ,  Masaji IMADA ,  Toshihiro NAKAMURA ,  Eiji YABUTA ,  Masayuki TAKENAKA

    IPC分类号： H05K1/02 ,  H05K1/18

    CPC分类号： H05K1/0204 ,  H01L23/13 ,  H01L23/367 ,  H01L23/3677 ,  H01L23/3735 ,  H01L2224/32225 ,  H01L2924/13055 ,  H01L2924/19105 ,  H05K1/0206 ,  H05K1/0209 ,  H05K1/181 ,  H05K1/182 ,  H05K7/205 ,  H05K7/20854 ,  H05K2201/09781 ,  H05K2201/10166 ,  H01L2924/00

    摘要： In an electronic device, a heat generating element is connected directly to an electrically-conductive joining material that is the start point of the heat dissipation path on the one surface of the substrate, and the other surface of the substrate is provided by an other surface side insulating layer. An electrically-conductive other surface side electrode connected to an external heat dissipation member is disposed on the surface of the other surface side insulating layer right under the heat generating element. On the other surface side of the substrate, an other surface side inner layer wire that is the end point of the heat dissipation path extends to the other surface side insulating layer and is insulated electrically from the other surface side electrode through the other surface side insulating layer.

    摘要翻译： 在电子设备中，发热元件直接连接到作为基板的一个表面上的散热路径的起始点的导电接合材料，并且基板的另一个表面由另一个表面 侧绝缘层。 连接到外部散热构件的导电的另一表面侧电极设置在发热元件正下方的另一表面侧绝缘层的表面上。 在基板的另一面侧，作为散热路径的端点的另一面侧内层线延伸到另一表面侧绝缘层，并且通过另一表面侧绝缘而与另一表面侧电极电绝缘 层。