Invention Application
US20160163939A1 OPTOELECTRONIC SEMICONDUCTOR CHIP, SEMICONDUCTOR COMPONENT AND METHOD OF PRODUCING OPTOELECTRONIC SEMICONDUCTOR CHIPS
审中-公开
光电子半导体芯片,半导体元件和生产光电半导体晶体管的方法
- Patent Title: OPTOELECTRONIC SEMICONDUCTOR CHIP, SEMICONDUCTOR COMPONENT AND METHOD OF PRODUCING OPTOELECTRONIC SEMICONDUCTOR CHIPS
- Patent Title (中): 光电子半导体芯片,半导体元件和生产光电半导体晶体管的方法
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Application No.: US14906724Application Date: 2014-07-17
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Publication No.: US20160163939A1Publication Date: 2016-06-09
- Inventor: Ralph Wagner , Thomas Veit , Björn Hoxhold , Philipp Schlosser
- Applicant: OSRAM OPTO SEMICONDUCTORS GMBH
- Priority: DE102013107971.7 20130725
- International Application: PCT/EP2014/065445 WO 20140717
- Main IPC: H01L33/62
- IPC: H01L33/62 ; H01L31/02 ; H01L31/0203 ; H01L33/52

Abstract:
An optoelectronic semiconductor chip includes a carrier, a semiconductor body having an active region that generates and/or receives radiation, and an insulation layer wherein the semiconductor body is fastened on the carrier with a connecting layer; the carrier extends in a vertical direction between a first main surface facing toward the semiconductor body, and a second main surface facing away from the semiconductor body, and a lateral surface connects the first main surface and the second main surface to one another; a first region of the lateral surface of the carrier has an indentation; a second region of the lateral surface runs in the vertical direction between the indentation and the second main surface; the insulation layer at least partially covers each of the semiconductor body and the first region; and the second region is free of the insulation layer.
Information query
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