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公开(公告)号：US20170331018A1
公开(公告)日：2017-11-16
申请号：US15524114
申请日：2015-11-03
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Frank Singer , Jürgen Moosburger , Matthias Sabathil , Matthias Sperl , Björn Hoxhold
CPC classification number: H01L33/62 , H01L25/167 , H01L33/005 , H01L33/486 , H01L33/502 , H01L33/54 , H01L33/60 , H01L2933/0033 , H01L2933/0041 , H01L2933/005 , H01L2933/0058 , H01L2933/0066
Abstract: An optoelectronic component includes a composite body including a molded body; and an optoelectronic semiconductor chip embedded into the molded body, wherein the optoelectronic semiconductor chip includes a first electrical contact on its top side, a first top side metallization is arranged on the top side of the composite body and electrically conductively connects the first electrical contact to the through contact, a second top side metallization is arranged on the top side of the composite body and electrically insulated with respect to the first top side metallization, the second top side metallization completely delimits a part of the top side of the optoelectronic semiconductor chip, and a wavelength-converting material is arranged in a region completely delimited by the second top side metallization on the top side of the composite body, the wavelength-converting material extending as far as the second top side metallization.
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公开(公告)号：US10205071B2
公开(公告)日：2019-02-12
申请号：US15577045
申请日：2016-05-19
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Thomas Schwarz , Andreas Biebersdorf , Dirk Becker , Bernd Barchmann , Björn Hoxhold , Philipp Schlosser , Andreas Waldschik
Abstract: A method of producing optoelectronic semiconductor components includes providing a carrier with a carrier underside and a carrier top. The carrier has a metallic core material and at least on the carrier top a metal layer. A dielectric mirror is applied to the core material. At least two holes are formed through the carrier. A ceramic layer with a thickness of at most 150 μm at least on the carrier underside and in the holes is produced. The ceramic layer includes the core material as a component. Metallic contact layers are applied to at least subregions of the ceramic layer on the carrier underside and in the holes so that the carrier top electrically connects to the carrier underside through the holes. At least one radiation-emitting semiconductor chip is applied to the carrier top and the semiconductor chip is electronically bonded to the contact layers.
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3.发明申请OPTOELECTRONIC SEMICONDUCTOR CHIP, SEMICONDUCTOR COMPONENT AND METHOD OF PRODUCING OPTOELECTRONIC SEMICONDUCTOR CHIPS 审中-公开光电子半导体芯片，半导体元件和生产光电半导体晶体管的方法公开(公告)号：US20160163939A1
公开(公告)日：2016-06-09
申请号：US14906724
申请日：2014-07-17
Applicant: OSRAM OPTO SEMICONDUCTORS GMBH
Inventor： Ralph Wagner , Thomas Veit , Björn Hoxhold , Philipp Schlosser
IPC: H01L33/62 , H01L31/02 , H01L31/0203 , H01L33/52
CPC classification number: H01L33/62 , H01L31/02005 , H01L31/0203 , H01L33/385 , H01L33/44 , H01L33/52 , H01L2933/0025 , H01L2933/0066
Abstract: An optoelectronic semiconductor chip includes a carrier, a semiconductor body having an active region that generates and/or receives radiation, and an insulation layer wherein the semiconductor body is fastened on the carrier with a connecting layer; the carrier extends in a vertical direction between a first main surface facing toward the semiconductor body, and a second main surface facing away from the semiconductor body, and a lateral surface connects the first main surface and the second main surface to one another; a first region of the lateral surface of the carrier has an indentation; a second region of the lateral surface runs in the vertical direction between the indentation and the second main surface; the insulation layer at least partially covers each of the semiconductor body and the first region; and the second region is free of the insulation layer.
Abstract translation: 光电半导体芯片包括载体，具有产生和/或接收辐射的有源区的半导体本体，以及绝缘层，其中半导体主体用连接层紧固在载体上; 载体在面向半导体主体的第一主表面和背离半导体本体的第二主表面之间沿垂直方向延伸，并且侧表面将第一主表面和第二主表面彼此连接; 载体的侧表面的第一区域具有凹陷; 侧表面的第二区域在凹陷和第二主表面之间沿垂直方向延伸; 绝缘层至少部分地覆盖半导体本体和第一区域中的每一个; 并且第二区域没有绝缘层。
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公开(公告)号：US10340430B2
公开(公告)日：2019-07-02
申请号：US15740999
申请日：2016-06-27
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Christian Leirer , Björn Hoxhold , Stefanie Rammelsberger
Abstract: An optoelectronic lamp device includes an optoelectronic semiconductor component including a top side including a light-emitting face, and a housing embedding the semiconductor component and leaving free the light-emitting face, wherein a housing face is coated with a light-scattering dielectric resist layer that may scatter light incident on a face of the resist layer facing away from the housing face.
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公开(公告)号：US20170317245A1
公开(公告)日：2017-11-02
申请号：US15524036
申请日：2015-10-16
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Björn Hoxhold , Matthias Kiessling , Matthias Sperl
Abstract: A method of applying a first material to a surface in a plurality of mutually separate coating regions includes: A) providing the surface containing the coating regions; B) producing a first masking layer on the surface by a photolithographic process, wherein the first masking layer includes a plurality of first openings arranged above the coating regions; C) providing a self-supporting second masking layer and then applying the second masking layer to the first masking layer, wherein the second masking layer includes a plurality of second openings arranged above the first openings and having a size less than or equal to a size of the first openings; and D) applying the first material to the surface in the coating regions through the first and second openings in the first and second masking layers.
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Patent Agency Ranking
公开(公告)号：US10923640B2
公开(公告)日：2021-02-16
申请号：US15771827
申请日：2016-10-28
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Thomas Schwarz , Stefan Listl , Björn Hoxhold , Frank Singer
IPC: H01L33/62 , H01L25/075 , H01L23/00 , H01L33/44 , H01L33/48 , H01L33/50 , H01L33/56 , H01L33/54 , G09F9/302 , G09F9/33
Abstract: An optoelectronic component includes a carrier, and a housing material arranged above a top side of a carrier, wherein a cavity is configured in the housing material, a top side of a first optoelectronic semiconductor chip is arranged in the cavity, the first optoelectronic semiconductor chip has a first electrical connection pad arranged at the top side of the first optoelectronic semiconductor chip, and electrically conductively connects by a bond wire to a first contact pad arranged at the top side of the carrier, a first section of the bond wire is arranged in the cavity and a second section of the bond wire is embedded the housing material, a covering material is arranged in the cavity and covers at least one part of the top side of the first optoelectronic semiconductor chip, and the first section of the bond wire is embedded in the covering material.
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公开(公告)号：US20180198044A1
公开(公告)日：2018-07-12
申请号：US15740999
申请日：2016-06-27
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Christian Leirer , Björn Hoxhold , Stefanie Rammelsberger
CPC classification number: H01L33/60 , H01L21/568 , H01L33/46 , H01L33/486 , H01L33/52 , H01L33/62 , H01L2224/04105 , H01L2224/19 , H01L2224/24 , H01L2224/82 , H01L2224/94 , H01L2933/005 , H01L2933/0058 , H01L2933/0066 , H01L2933/0091
Abstract: An optoelectronic lamp device includes an optoelectronic semiconductor component including a top side including a light-emitting face, and a housing embedding the semiconductor component and leaving free the light-emitting face, wherein a housing face is coated with a light-scattering dielectric resist layer that may scatter light incident on a face of the resist layer facing away from the housing face.
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公开(公告)号：US09876155B2
公开(公告)日：2018-01-23
申请号：US15524114
申请日：2015-11-03
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Frank Singer , Jürgen Moosburger , Matthias Sabathil , Matthias Sperl , Björn Hoxhold
CPC classification number: H01L33/62 , H01L25/167 , H01L33/005 , H01L33/486 , H01L33/502 , H01L33/54 , H01L33/60 , H01L2933/0033 , H01L2933/0041 , H01L2933/005 , H01L2933/0058 , H01L2933/0066
Abstract: An optoelectronic component includes a composite body including a molded body; and an optoelectronic semiconductor chip embedded into the molded body, wherein the optoelectronic semiconductor chip includes a first electrical contact on its top side, a first top side metallization is arranged on the top side of the composite body and electrically conductively connects the first electrical contact to the through contact, a second top side metallization is arranged on the top side of the composite body and electrically insulated with respect to the first top side metallization, the second top side metallization completely delimits a part of the top side of the optoelectronic semiconductor chip, and a wavelength-converting material is arranged in a region completely delimited by the second top side metallization on the top side of the composite body, the wavelength-converting material extending as far as the second top side metallization.
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公开(公告)号：US20180358522A1
公开(公告)日：2018-12-13
申请号：US15771827
申请日：2016-10-28
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Thomas Schwarz , Stefan Listl , Björn Hoxhold , Frank Singer
CPC classification number: H01L33/62 , G09F9/3026 , G09F9/33 , H01L24/48 , H01L25/0753 , H01L33/44 , H01L33/483 , H01L33/502 , H01L33/54 , H01L33/56 , H01L2224/48091 , H01L2224/48139 , H01L2224/48227 , H01L2224/49113 , H01L2224/73265 , H01L2924/12041 , H01L2933/0025 , H01L2933/005 , H01L2933/0066 , H01L2933/0091 , H01L2924/00014
Abstract: An optoelectronic component includes a carrier, and a housing material arranged above a top side of a carrier, wherein a cavity is configured in the housing material, a top side of a first optoelectronic semiconductor chip is arranged in the cavity, the first optoelectronic semiconductor chip has a first electrical connection pad arranged at the top side of the first optoelectronic semiconductor chip, and electrically conductively connects by a bond wire to a first contact pad arranged at the top side of the carrier, a first section of the bond wire is arranged in the cavity and a second section of the bond wire is embedded the housing material, a covering material is arranged in the cavity and covers at least one part of the top side of the first optoelectronic semiconductor chip, and the first section of the bond wire is embedded in the covering material.
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10.发明申请公开(公告)号：US20180145234A1
公开(公告)日：2018-05-24
申请号：US15577045
申请日：2016-05-19
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Thomas Schwarz , Andreas Biebersdorf , Dirk Becker , Bernd Barchmann , Björn Hoxhold , Philipp Schlosser , Andreas Waldschik
IPC: H01L33/60 , H01L33/62 , H01L33/00 , H01L25/075
CPC classification number: H01L33/60 , H01L25/0753 , H01L33/005 , H01L33/486 , H01L33/62 , H01L33/647 , H01L2224/48091 , H01L2224/48137 , H01L2224/48471 , H01L2224/48479 , H01L2224/73265 , H01L2924/00014 , H01L2924/181 , H01L2933/0033 , H01L2933/0075 , H01L2924/00012 , H01L2224/4554
Abstract: A method of producing optoelectronic semiconductor components includes providing a carrier with a carrier underside and a carrier top, wherein the carrier has a metallic core material and at least on the carrier top a metal layer and following this a dielectric mirror are applied to the core material, forming at least two holes through the carrier, producing a ceramic layer with a thickness of at most 150 μm at least on the carrier underside and in the holes, wherein the ceramic layer includes the core material as a component, applying metallic contact layers to at least subregions of the ceramic layer on the carrier underside and in the holes so that the carrier top electrically connects to the carrier underside through the holes, and applying at least one radiation-emitting semiconductor chip to the carrier top and electrical bonding of the semiconductor chip to the contact layers.
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