OPTOELECTRONIC SEMICONDUCTOR CHIP, SEMICONDUCTOR COMPONENT AND METHOD OF PRODUCING OPTOELECTRONIC SEMICONDUCTOR CHIPS
    3.
    发明申请
    OPTOELECTRONIC SEMICONDUCTOR CHIP, SEMICONDUCTOR COMPONENT AND METHOD OF PRODUCING OPTOELECTRONIC SEMICONDUCTOR CHIPS 审中-公开
    光电子半导体芯片,半导体元件和生产光电半导体晶体管的方法

    公开(公告)号:US20160163939A1

    公开(公告)日:2016-06-09

    申请号:US14906724

    申请日:2014-07-17

    Abstract: An optoelectronic semiconductor chip includes a carrier, a semiconductor body having an active region that generates and/or receives radiation, and an insulation layer wherein the semiconductor body is fastened on the carrier with a connecting layer; the carrier extends in a vertical direction between a first main surface facing toward the semiconductor body, and a second main surface facing away from the semiconductor body, and a lateral surface connects the first main surface and the second main surface to one another; a first region of the lateral surface of the carrier has an indentation; a second region of the lateral surface runs in the vertical direction between the indentation and the second main surface; the insulation layer at least partially covers each of the semiconductor body and the first region; and the second region is free of the insulation layer.

    Abstract translation: 光电半导体芯片包括载体,具有产生和/或接收辐射的有源区的半导体本体,以及绝缘层,其中半导体主体用连接层紧固在载体上; 载体在面向半导体主体的第一主表面和背离半导体本体的第二主表面之间沿垂直方向延伸,并且侧表面将第一主表面和第二主表面彼此连接; 载体的侧表面的第一区域具有凹陷; 侧表面的第二区域在凹陷和第二主表面之间沿垂直方向延伸; 绝缘层至少部分地覆盖半导体本体和第一区域中的每一个; 并且第二区域没有绝缘层。

    METHOD OF APPLYING A MATERIAL TO A SURFACE
    5.
    发明申请

    公开(公告)号:US20170317245A1

    公开(公告)日:2017-11-02

    申请号:US15524036

    申请日:2015-10-16

    Abstract: A method of applying a first material to a surface in a plurality of mutually separate coating regions includes: A) providing the surface containing the coating regions; B) producing a first masking layer on the surface by a photolithographic process, wherein the first masking layer includes a plurality of first openings arranged above the coating regions; C) providing a self-supporting second masking layer and then applying the second masking layer to the first masking layer, wherein the second masking layer includes a plurality of second openings arranged above the first openings and having a size less than or equal to a size of the first openings; and D) applying the first material to the surface in the coating regions through the first and second openings in the first and second masking layers.

    Optoelectronic component and method of producing same

    公开(公告)号:US10923640B2

    公开(公告)日:2021-02-16

    申请号:US15771827

    申请日:2016-10-28

    Abstract: An optoelectronic component includes a carrier, and a housing material arranged above a top side of a carrier, wherein a cavity is configured in the housing material, a top side of a first optoelectronic semiconductor chip is arranged in the cavity, the first optoelectronic semiconductor chip has a first electrical connection pad arranged at the top side of the first optoelectronic semiconductor chip, and electrically conductively connects by a bond wire to a first contact pad arranged at the top side of the carrier, a first section of the bond wire is arranged in the cavity and a second section of the bond wire is embedded the housing material, a covering material is arranged in the cavity and covers at least one part of the top side of the first optoelectronic semiconductor chip, and the first section of the bond wire is embedded in the covering material.

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