Invention Application
- Patent Title: Optoelectronic Semiconductor Chip
- Patent Title (中): 光电半导体芯片
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Application No.: US14905763Application Date: 2014-06-25
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Publication No.: US20160172545A1Publication Date: 2016-06-16
- Inventor: Karl Engl , Georg Hartung , Johann Eibl , Michael Huber , Markus Maute
- Applicant: OSRAM OPTO SEMICONDUCTORS GMBH
- Priority: DE102013107531.2 20130716
- International Application: PCT/EP2014/063423 WO 20140625
- Main IPC: H01L33/46
- IPC: H01L33/46 ; H01L33/62 ; H01L33/50
Abstract:
An optoelectronic semi-conductor chip is disclosed in which an encapsulation layer, which is an ALD layer, completely covers a first mirror layer on the side thereof facing away from a p-conductive region, and is arranged to be in direct contact with said first mirror layer in some sections.
Public/Granted literature
- US10014444B2 Optoelectronic semiconductor chip Public/Granted day:2018-07-03
Information query
IPC分类:
