Invention Application
- Patent Title: UV CURABLE CMP POLISHING PAD AND METHOD OF MANUFACTURE
- Patent Title (中): UV可固化CMP抛光垫及其制造方法
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Application No.: US14575608Application Date: 2014-12-18
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Publication No.: US20160176021A1Publication Date: 2016-06-23
- Inventor: Mahendra Christopher Orilall , Rajeev Bajaj , Fred C. Redeker
- Applicant: Applied Materials, Inc.
- Main IPC: B24D11/00
- IPC: B24D11/00 ; B24D3/32 ; B29C35/08

Abstract:
A method of fabricating a chemical mechanical polishing pad includes introducing polymer precursors containing acrylate functional groups into a mold, providing abrasive particles and a photo-initiator in the polymer precursors to form a mixture, and while the mixture is contained between a bottom plate and a top cover of the mold, exposing the mixture to ultraviolet radiation through a transparent section of the mold to cause the polymer precursors to form radicals, forming a polymer matrix from the polymer precursor by causing the radicals to cross-link with one another. The polishing layer includes the polymer matrix having the abrasive particles dispersed therein.
Public/Granted literature
- US10086500B2 Method of manufacturing a UV curable CMP polishing pad Public/Granted day:2018-10-02
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