Invention Application
- Patent Title: HEAT PIPE
- Patent Title (中): 热管
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Application No.: US14704218Application Date: 2015-05-05
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Publication No.: US20160201992A1Publication Date: 2016-07-14
- Inventor: Shih-Lin HUANG , Chiu-Kung CHEN , Sien WU , Ti-Jun WANG
- Applicant: DELTA ELECTRONICS, INC.
- Priority: CN201510011351.7 20150109
- Main IPC: F28D15/02
- IPC: F28D15/02
Abstract:
A heat pipe is disclosed in the present invention. The heat pipe includes a first pipe and at least a second pipe. The first pipe is formed with an enclosed space. The second pipe is disposed in the enclosed space. There is no wick structure disposed between the first pipe and the second pipe.
Information query
