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公开(公告)号：US20180038659A1
公开(公告)日：2018-02-08
申请号：US15783300
申请日：2017-10-13
Applicant: DELTA ELECTRONICS, INC.
Inventor： Shih-Lin HUANG , Chiu-Kung CHEN , Sien WU , Ti-Jun WANG
IPC: F28D15/02
CPC classification number: F28D15/02 , F28D15/025
Abstract: A heat pipe is disclosed in the present invention. The heat pipe includes a first pipe and at least a second pipe. The first pipe is formed with an enclosed space. The second pipe is disposed in the enclosed space. There is no wick structure disposed between the first pipe and the second pipe.
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公开(公告)号：US20160153720A1
公开(公告)日：2016-06-02
申请号：US14610503
申请日：2015-01-30
Applicant: DELTA ELECTRONICS, INC.
Inventor： Shih-Lin HUANG , Chiu-Kung CHEN , Ti-Jun WANG
IPC: F28D15/02
CPC classification number: F28D15/046
Abstract: A heat pipe is divided into an evaporation section, an insulation section and a condensation section. The insulation section includes a pipe section and a liquid delivery structure. The pipe section has a top wall and a bottom wall. The liquid delivery structure is a solid structure and in contact with the top and bottom walls of the pipe section. The liquid delivery structure and the top and bottom walls of the pipe section form a vapor channel. The liquid delivery structure is divided into a center portion and an outer layer, and the center portion has a porosity greater than the porosity of the outer layer. The outer layer is coupled to the center portion, and the center portion and the vapor channel are spaced from one another, so as to achieve the liquid and vapor isolation and improve the heat conducting effect of the heat pipe.
Abstract translation: 热管被分为蒸发部，绝缘部和冷凝部。 绝缘部分包括管段和液体输送结构。 管段具有顶壁和底壁。 液体输送结构是固体结构并与管段的顶壁和底壁接触。 液体输送结构和管段的顶壁和底壁形成蒸气通道。 液体输送结构分为中心部分和外层，中心部分的孔隙率大于外层的孔隙率。 外层与中心部分连接，中心部分和蒸气通道彼此间隔开，从而实现液体和蒸汽隔离，并提高热管的导热效果。
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公开(公告)号：US20230021686A1
公开(公告)日：2023-01-26
申请号：US17959971
申请日：2022-10-04
Applicant: DELTA ELECTRONICS, INC.
Inventor： Shih-Lin HUANG , Wen-Shiang CHEN , Shu-Cheng YANG
Abstract: An internal structure of vapor chamber is provided. A first plate has an inner surface. A periphery of the first plate has a sealing edge extending outwardly; a level difference exists between the first plate and the sealing edge. Multiple supporting protrusions are formed on the inner surface of the first plate. A second plate has an inner surface spaced apart from the inner surface of the first plate. The brazing structure has a sealing portion and connecting portions, the sealing portion is fixed between the second plate and the sealing edges of the first plate, and the connecting portions are respectively disposed between the corresponding supporting portions of the first plate and of the second plate. The sealing portion is disposed around a periphery of the second plate to align and contact with the sealing edge.
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公开(公告)号：US20210247153A1
公开(公告)日：2021-08-12
申请号：US17243480
申请日：2021-04-28
Applicant: Delta Electronics, Inc.
Inventor： Shih-Lin HUANG , Sien WU , Baoxun HE , Ti-Jun WANG
Abstract: A vapor chamber with a support structure and its manufacturing method are provided. The vapor chamber with the support structure includes a first plate, a second plate spaced apart from the first plate, and multiple support elements fixed between the first and second plates. On an outer surface of any of the first plate or the second plate, laser welding is performed on positions corresponding to the support elements so as to join the support elements to the first and second plates and to form weld ports on the outer surface of any of the plates. The invention solves the problem of fixing the support structure inside the thin vapor chamber, and therefore mass production can be realized.
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公开(公告)号：US20200306870A1
公开(公告)日：2020-10-01
申请号：US16807649
申请日：2020-03-03
Applicant: Delta Electronics, Inc.
Inventor： Shih-Lin HUANG , Tai-De QI , Zhen-Hua LI
IPC: B23K20/10
Abstract: A heat transmitting device is provided, including a main body and an integrating portion. The main body has at least one opening. The integrating portion is used to seal the opening, and has a first surface and a second surface opposite the first surface. A first welding pattern is formed on the first surface, a second welding pattern is formed on the second surface, and the position of the first welding pattern corresponds to that of the second welding pattern. The type of the first welding pattern and the type of the second welding pattern are asymmetric.
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Patent Agency Ranking
公开(公告)号：US20240011719A1
公开(公告)日：2024-01-11
申请号：US18471079
申请日：2023-09-20
Applicant: DELTA ELECTRONICS, INC.
Inventor： Shih-Lin HUANG , Chiu-Kung CHEN , Sheng-Hua LUO , Ti-Jun WANG
CPC classification number: F28D15/046 , F28D15/0233
Abstract: A heat pipe comprises a flat tube and a wick structure. The flat tube includes a hollow chamber and has a front and a rear sealed ends along an axial direction. The wick structure is disposed in the hollow chamber and extended along the axial direction of the flat tube. The wick structure is divided into a front, a middle and a rear sections sequentially along the axial direction. The front section is near the front sealed end, the rear section is near the rear sealed end. The front, middle and rear sections have a maximum length parallel to the width direction, respectively. The maximum length of the front section is greater than that of the middle section, and the maximum length of the middle section is greater than that of the rear section.
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公开(公告)号：US20210088289A1
公开(公告)日：2021-03-25
申请号：US17111077
申请日：2020-12-03
Applicant: DELTA ELECTRONICS, INC.
Inventor： Shih-Lin HUANG , Chiu-Kung CHEN , Ting-Yuan WU
IPC: F28D15/04 , H01L23/427
Abstract: A vapor chamber is provided. The vapor chamber is adapted to be thermally connected to an electronic element. The vapor chamber includes a first member and a second member. The first member has a first heat transfer coefficient. The first member is connected to the electronic element. The second member has a second heat transfer coefficient. The second member is combined with the first member. The first member is located between the second member and the electronic element. The first heat transfer coefficient is greater than the second heat transfer coefficient.
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公开(公告)号：US20180087844A1
公开(公告)日：2018-03-29
申请号：US15718428
申请日：2017-09-28
Applicant: DELTA ELECTRONICS, INC.
Inventor： Shih-Lin HUANG
CPC classification number: F28D15/04 , F28D15/0233 , F28D15/0283 , F28F3/12 , F28F9/26 , F28F2210/02 , F28F2275/025 , F28F2275/061 , F28F2275/065 , F28F2275/067 , H05K7/20336
Abstract: A heat pipe structure includes a first plate, a second plate and a plurality of wick structures. The second plate is connected to the first plate to form a chamber. The wick structures are disposed in the chamber, and the distribution shape of the wick structures is approximately the same as the shape of a portion of the chamber. The chamber is formed by at least one coupling portion and three or more extending portions. The coupling portion communicates with the extending portions, and the contour of the connected first and second plates is different from that of the chamber.
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公开(公告)号：US20170343299A1
公开(公告)日：2017-11-30
申请号：US15397067
申请日：2017-01-03
Applicant: Delta Electronics, Inc.
Inventor： Shih-Lin HUANG , Chiu-Kung CHEN , Ti-Jun WANG , Quan ZHANG
Abstract: A heat pipe is provided, including a capillary body. The capillary body has a condensation portion, an evaporation portion, and a connecting portion connecting the condensation portion with the evaporation portion. The capillary body is formed by metal weaving. A cross-section of the evaporation portion is larger than that of the condensation portion.
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公开(公告)号：US20170023308A1
公开(公告)日：2017-01-26
申请号：US15215084
申请日：2016-07-20
Applicant: DELTA ELECTRONICS, INC.
Inventor： Shih-Lin HUANG , Ting-Yuan WU , Chiu-Kung CHEN , Chun-Lung CHIU
CPC classification number: F28D15/046 , F28D15/0233 , F28D2021/0028 , F28F3/00 , F28F3/022 , F28F13/06 , F28F2225/04 , F28F2255/18
Abstract: A slim vapor chamber includes a first plate, a second plate and a capillary structure. The periphery of the second plate is connected with that of the first plate to form a chamber. The capillary structure is disposed in the chamber. At least one of a side of the first plate facing the second plate and a side of the second plate facing the first plate is formed with a plurality of supporting structures, which include a plurality of supporting pillars and a plurality of supporting plates, by an etching process.
Abstract translation: 薄型蒸气室包括第一板，第二板和毛细结构。 第二板的周边与第一板的周边连接以形成室。 毛细结构设置在腔室中。 所述第一板的面对所述第二板的一侧中的至少一侧和所述第二板的面向所述第一板的一侧形成有多个支撑结构，所述多个支撑结构包括多个支撑柱和多个支撑板， 蚀刻工艺。
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