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    HEAT PIPE
    2.
    发明申请
    HEAT PIPE 审中-公开

    公开(公告)号：US20180038659A1

    公开(公告)日：2018-02-08

    申请号：US15783300

    申请日：2017-10-13

    Applicant: DELTA ELECTRONICS, INC.

    Inventor： Shih-Lin HUANG ,  Chiu-Kung CHEN ,  Sien WU ,  Ti-Jun WANG

    IPC: F28D15/02

    CPC classification number: F28D15/02 ,  F28D15/025

    Abstract: A heat pipe is disclosed in the present invention. The heat pipe includes a first pipe and at least a second pipe. The first pipe is formed with an enclosed space. The second pipe is disposed in the enclosed space. There is no wick structure disposed between the first pipe and the second pipe.

    HEAT PIPE
    3.
    发明申请
    HEAT PIPE 审中-公开
    热管

    公开(公告)号：US20160153720A1

    公开(公告)日：2016-06-02

    申请号：US14610503

    申请日：2015-01-30

    Applicant: DELTA ELECTRONICS, INC.

    Inventor： Shih-Lin HUANG ,  Chiu-Kung CHEN ,  Ti-Jun WANG

    IPC: F28D15/02

    CPC classification number: F28D15/046

    Abstract: A heat pipe is divided into an evaporation section, an insulation section and a condensation section. The insulation section includes a pipe section and a liquid delivery structure. The pipe section has a top wall and a bottom wall. The liquid delivery structure is a solid structure and in contact with the top and bottom walls of the pipe section. The liquid delivery structure and the top and bottom walls of the pipe section form a vapor channel. The liquid delivery structure is divided into a center portion and an outer layer, and the center portion has a porosity greater than the porosity of the outer layer. The outer layer is coupled to the center portion, and the center portion and the vapor channel are spaced from one another, so as to achieve the liquid and vapor isolation and improve the heat conducting effect of the heat pipe.

    Abstract translation: 热管被分为蒸发部，绝缘部和冷凝部。 绝缘部分包括管段和液体输送结构。 管段具有顶壁和底壁。 液体输送结构是固体结构并与管段的顶壁和底壁接触。 液体输送结构和管段的顶壁和底壁形成蒸气通道。 液体输送结构分为中心部分和外层，中心部分的孔隙率大于外层的孔隙率。 外层与中心部分连接，中心部分和蒸气通道彼此间隔开，从而实现液体和蒸汽隔离，并提高热管的导热效果。

    VAPOR CHAMBER
    4.
    发明公开
    VAPOR CHAMBER 审中-公开

    公开(公告)号：US20240295366A1

    公开(公告)日：2024-09-05

    申请号：US18662214

    申请日：2024-05-13

    Applicant: Delta Electronics, Inc.

    Inventor： Shih-Lin HUANG ,  Chiu-Kung CHEN ,  Ting-Yuan WU

    IPC: F28D15/04 ,  F28D15/02 ,  F28D21/00 ,  H01L23/427

    CPC classification number: F28D15/046 ,  H01L23/427 ,  F28D15/0233 ,  F28D2021/0028

    Abstract: A vapor chamber is provided. The vapor chamber is adapted to be thermally connected to an electronic element. The vapor chamber includes a first member and a second member. The first member has a first heat transfer coefficient. The first member is connected to the electronic element. The second member has a second heat transfer coefficient. The second member is combined with the first member. The first member is located between the second member and the electronic element. The first heat transfer coefficient is greater than the second heat transfer coefficient.

    HEAT PIPE WITH CAPILLARY STRUCTURE
    5.
    发明申请
    HEAT PIPE WITH CAPILLARY STRUCTURE 有权

    公开(公告)号：US20220390185A1

    公开(公告)日：2022-12-08

    申请号：US17889658

    申请日：2022-08-17

    Applicant: DELTA ELECTRONICS, INC.

    Inventor： Shih-Lin HUANG ,  Chiu-Kung CHEN

    IPC: F28D15/04 ,  F28F13/00 ,  F28D15/02

    Abstract: A heat pipe comprises a first pipe and at least a second pipe. The first pipe includes an evaporator, a heat insulator and a condenser communicating with each other to define a hollow chamber. The second pipe disposed in the hollow chamber includes an accommodating space and a first capillary structure disposed in one end of the accommodating space closer to the evaporator. At least one side of an outer pipe wall of the second pipe directly abuts an inner pipe wall of the first pipe. The first pipe further includes a second capillary structure disposed in the hollow chamber closer to the evaporator and extended to an outside of the second pipe and occupies at least 2/3 volume of the evaporator. A first part of the first capillary structure and the second capillary structure are connected to each other by winding so as to enhance transportation therebetween.

    HEAT PIPE
    6.
    发明申请
    HEAT PIPE 审中-公开
    热管

    公开(公告)号：US20160153723A1

    公开(公告)日：2016-06-02

    申请号：US14818716

    申请日：2015-08-05

    Applicant: DELTA ELECTRONICS, INC.

    Inventor： Shih-Lin HUANG ,  Chiu-Kung CHEN ,  Sheng-Hua LUO ,  Ti-Jun WANG

    IPC: F28D15/04

    CPC classification number: F28D15/046 ,  F28D15/0233

    Abstract: A heat pipe comprises a pipe and at least a wick structure. The pipe includes a hollow chamber. The wick structure is disposed in the hollow chamber and extended along an axial direction of the pipe. A section of the wick structure along the axial direction is not a uniform section between two ends of the pipe.

    Abstract translation: 热管包括管道和至少一个灯芯结构。 管子包括一个中空室。 芯体结构设置在中空室中并沿着管的轴向延伸。 油芯结构沿轴向的一部分在管的两端之间不是均匀的部分。

    HEAT PIPE
    7.
    发明公开
    HEAT PIPE 审中-公开

    公开(公告)号：US20240011719A1

    公开(公告)日：2024-01-11

    申请号：US18471079

    申请日：2023-09-20

    Applicant: DELTA ELECTRONICS, INC.

    Inventor： Shih-Lin HUANG ,  Chiu-Kung CHEN ,  Sheng-Hua LUO ,  Ti-Jun WANG

    IPC: F28D15/04 ,  F28D15/02

    CPC classification number: F28D15/046 ,  F28D15/0233

    Abstract: A heat pipe comprises a flat tube and a wick structure. The flat tube includes a hollow chamber and has a front and a rear sealed ends along an axial direction. The wick structure is disposed in the hollow chamber and extended along the axial direction of the flat tube. The wick structure is divided into a front, a middle and a rear sections sequentially along the axial direction. The front section is near the front sealed end, the rear section is near the rear sealed end. The front, middle and rear sections have a maximum length parallel to the width direction, respectively. The maximum length of the front section is greater than that of the middle section, and the maximum length of the middle section is greater than that of the rear section.

    VAPOR CHAMBER
    8.
    发明申请
    VAPOR CHAMBER 有权

    公开(公告)号：US20210088289A1

    公开(公告)日：2021-03-25

    申请号：US17111077

    申请日：2020-12-03

    Applicant: DELTA ELECTRONICS, INC.

    Inventor： Shih-Lin HUANG ,  Chiu-Kung CHEN ,  Ting-Yuan WU

    IPC: F28D15/04 ,  H01L23/427

    Abstract: A vapor chamber is provided. The vapor chamber is adapted to be thermally connected to an electronic element. The vapor chamber includes a first member and a second member. The first member has a first heat transfer coefficient. The first member is connected to the electronic element. The second member has a second heat transfer coefficient. The second member is combined with the first member. The first member is located between the second member and the electronic element. The first heat transfer coefficient is greater than the second heat transfer coefficient.

    SLIM VAPOR CHAMBER
    10.
    发明申请
    SLIM VAPOR CHAMBER 审中-公开
    SLIM蒸汽房

    公开(公告)号：US20170023308A1

    公开(公告)日：2017-01-26

    申请号：US15215084

    申请日：2016-07-20

    Applicant: DELTA ELECTRONICS, INC.

    Inventor： Shih-Lin HUANG ,  Ting-Yuan WU ,  Chiu-Kung CHEN ,  Chun-Lung CHIU

    IPC: F28D15/04 ,  F28F13/06 ,  F28F3/00

    CPC classification number: F28D15/046 ,  F28D15/0233 ,  F28D2021/0028 ,  F28F3/00 ,  F28F3/022 ,  F28F13/06 ,  F28F2225/04 ,  F28F2255/18

    Abstract: A slim vapor chamber includes a first plate, a second plate and a capillary structure. The periphery of the second plate is connected with that of the first plate to form a chamber. The capillary structure is disposed in the chamber. At least one of a side of the first plate facing the second plate and a side of the second plate facing the first plate is formed with a plurality of supporting structures, which include a plurality of supporting pillars and a plurality of supporting plates, by an etching process.

    Abstract translation: 薄型蒸气室包括第一板，第二板和毛细结构。 第二板的周边与第一板的周边连接以形成室。 毛细结构设置在腔室中。 所述第一板的面对所述第二板的一侧中的至少一侧和所述第二板的面向所述第一板的一侧形成有多个支撑结构，所述多个支撑结构包括多个支撑柱和多个支撑板， 蚀刻工艺。

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