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公开(公告)号：US20230339053A1
公开(公告)日：2023-10-26
申请号：US18215022
申请日：2023-06-27
Applicant: DELTA ELECTRONICS, INC.
Inventor： Shih-Lin HUANG , Sien WU , Baoxun HE , Ti-Jun WANG
CPC classification number: B23P15/26 , F28D15/04 , F28D15/0233 , B23K26/21 , F28F19/00
Abstract: A vapor chamber with a support structure is provided. The vapor chamber with the support structure includes a first plate, a second plate spaced apart from the first plate, and multiple support elements fixed between the first and second plates. On an outer surface of any of the first plate or the second plate, laser welding is performed on positions corresponding to the support elements so as to join the support elements to the first and second plates and to form weld ports on the outer surface of any of the plates. The invention solves the problem of fixing the support structure inside the thin vapor chamber, and therefore mass production can be realized.
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Patent Agency Ranking
公开(公告)号：US20160201992A1
公开(公告)日：2016-07-14
申请号：US14704218
申请日：2015-05-05
Applicant: DELTA ELECTRONICS, INC.
Inventor： Shih-Lin HUANG , Chiu-Kung CHEN , Sien WU , Ti-Jun WANG
IPC: F28D15/02
CPC classification number: F28D15/02 , F28D15/025
Abstract: A heat pipe is disclosed in the present invention. The heat pipe includes a first pipe and at least a second pipe. The first pipe is formed with an enclosed space. The second pipe is disposed in the enclosed space. There is no wick structure disposed between the first pipe and the second pipe.
Abstract translation: 在本发明中公开了一种热管。 热管包括第一管和至少第二管。 第一个管道形成一个封闭的空间。 第二管道设置在封闭空间内。 在第一管和第二管之间没有设置芯体结构。
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公开(公告)号：US20180038659A1
公开(公告)日：2018-02-08
申请号：US15783300
申请日：2017-10-13
Applicant: DELTA ELECTRONICS, INC.
Inventor： Shih-Lin HUANG , Chiu-Kung CHEN , Sien WU , Ti-Jun WANG
IPC: F28D15/02
CPC classification number: F28D15/02 , F28D15/025
Abstract: A heat pipe is disclosed in the present invention. The heat pipe includes a first pipe and at least a second pipe. The first pipe is formed with an enclosed space. The second pipe is disposed in the enclosed space. There is no wick structure disposed between the first pipe and the second pipe.
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公开(公告)号：US20210247153A1
公开(公告)日：2021-08-12
申请号：US17243480
申请日：2021-04-28
Applicant: Delta Electronics, Inc.
Inventor： Shih-Lin HUANG , Sien WU , Baoxun HE , Ti-Jun WANG
Abstract: A vapor chamber with a support structure and its manufacturing method are provided. The vapor chamber with the support structure includes a first plate, a second plate spaced apart from the first plate, and multiple support elements fixed between the first and second plates. On an outer surface of any of the first plate or the second plate, laser welding is performed on positions corresponding to the support elements so as to join the support elements to the first and second plates and to form weld ports on the outer surface of any of the plates. The invention solves the problem of fixing the support structure inside the thin vapor chamber, and therefore mass production can be realized.
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公开(公告)号：US20190249938A1
公开(公告)日：2019-08-15
申请号：US16264612
申请日：2019-01-31
Applicant: Delta Electronics, Inc.
Inventor： Shih-Lin HUANG , Sien WU , Baoxun HE , Ti-Jun WANG
CPC classification number: F28F19/00 , F28D15/0233 , F28D15/04 , F28F21/083 , F28F21/085 , F28F21/086 , F28F2225/04 , F28F2275/067
Abstract: A vapor chamber with a support structure and its manufacturing method are provided. The vapor chamber with the support structure includes a first plate, a second plate spaced apart from the first plate, and multiple support elements fixed between the first and second plates. On an outer surface of any of the first plate or the second plate, laser welding is performed on positions corresponding to the support elements so as to join the support elements to the first and second plates and to form weld ports on the outer surface of any of the plates. The invention solves the problem of fixing the support structure inside the thin vapor chamber, and therefore mass production can be realized.
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公开(公告)号：US20160153722A1
公开(公告)日：2016-06-02
申请号：US14793132
申请日：2015-07-07
Applicant: DELTA ELECTRONICS, INC.
Inventor： Shih-Lin HUANG , Chiu-Kung CHEN , Sien WU , Ti-Jun WANG
IPC: F28D15/04
CPC classification number: F28D15/046 , F28D15/0233
Abstract: A heat pipe comprises a first pipe and at least a second pipe. The first pipe includes an evaporator, a heat insulator and a condenser communicating with each other to define a hollow chamber. Two ends of first pipe along an axial direction of the heat pipe are sealed. The second pipe is disposed in the hollow chamber and includes an accommodating space and a first capillary structure disposed in one end of the accommodating space closer to the evaporator. The hollow chamber of the first pipe is mainly a channel for vapor, the second pipe is mainly a channel for working fluid, the vapor is driven by the vapor pressure difference to move in the first pipe and from the evaporator to the condenser, and the working fluid is driven by the vapor pressure difference to flow in the second pipe and from the condenser to the evaporator.
Abstract translation: 热管包括第一管和至少第二管。 第一管包括蒸发器，隔热件和冷凝器，它们彼此连通以限定中空室。 沿着热管的轴向的第一管的两端被密封。 第二管设置在中空室中，并且包括容纳空间和布置在容纳空间的靠近蒸发器的一端的第一毛细管结构。 第一管的中空室主要是蒸汽通道，第二管主要是工作流体的通道，蒸气由蒸气压差驱动，在第一管和蒸发器中移动到冷凝器， 工作流体由蒸汽压力差驱动，在第二管和从冷凝器流到蒸发器。
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