Invention Application
- Patent Title: TREATMENT OF SUBSTRATE SUB-SURFACE
- Patent Title (中): 基层表面处理
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Application No.: US14834315Application Date: 2015-08-24
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Publication No.: US20160202732A1Publication Date: 2016-07-14
- Inventor: Ming Kun Shi , Jason O. Mettler , Hilbert T. Kwan , Christopher Bruni , Qi Tian , Jing Zhang , Howard E. Bujtor , Stephen V. Jayanathan , Houtan R. Farahani
- Applicant: Apple Inc.
- Main IPC: G06F1/16
- IPC: G06F1/16 ; H05K3/00 ; H05K3/28 ; H05K5/02

Abstract:
Perforated structures and methods for forming perforated structures are disclosed. The perforated structures include partial holes or blind-holes that pass partially through the substrate. The partial holes can be positioned proximate to through-holes that pass entirely through the substrate. The partial holes add mechanical strength to the perforated substrate. Described are methods for modifying the optical appearance of the partial holes such that the partial holes appear indistinguishable from the through-holes, which allows for flexibility in designing cosmetically appealing patterns within the perforated structures.
Public/Granted literature
- US09710023B2 Treatment of substrate sub-surface Public/Granted day:2017-07-18
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