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公开(公告)号:US09977464B2
公开(公告)日:2018-05-22
申请号:US14836943
申请日:2015-08-26
Applicant: Apple Inc.
Inventor: Jeffrey C. Mylvaganam , Erik G. de Jong , Dale N. Memering , Xiao Bing Cai , Palaniappan Chinnakaruppan , Jong Kong Lee , Srikanth Kamireddi , Sawako Kamei , Feng Min , Jing Zhang , Xiang Du , Sai Feng Liu
IPC: G06F1/16 , H01Q1/24 , B24B29/00 , B24B37/04 , B24C11/00 , B24B7/22 , G04B39/00 , B23K26/364 , B05D1/02 , B23K26/402 , B24C1/08 , G04B37/00 , B23K103/00
CPC classification number: G06F1/1637 , B05D1/02 , B23K26/364 , B23K26/402 , B23K2103/50 , B23K2103/54 , B24B7/228 , B24B29/005 , B24B37/04 , B24C1/08 , B24C11/00 , G04B37/0008 , G04B39/006 , G06F1/163 , H01Q1/243
Abstract: A cover for an electronic device and methods of forming a cover is disclosed. The electronic device may include a housing, and a cover coupled to the housing. The cover may have an inner surface having at least one of an intermediate polish and a final polish, a groove formed on the inner surface, and an outer surface positioned opposite the inner surface. The outer surface may have at least one of the intermediate polish and the final polish. The cover may also have a rounded perimeter portion formed between the inner surface and the outer surface. The rounded perimeter portion may be positioned adjacent the groove. The method for forming the cover may include performing a first polishing process on the sapphire component using a polishing tool, and performing a second polishing process on the groove of the sapphire component forming the cover using blasting media.
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公开(公告)号:US20230223212A1
公开(公告)日:2023-07-13
申请号:US17972446
申请日:2022-10-24
Applicant: Apple Inc.
Inventor: Ming Kun Shi , Jing Zhang , Lei Ding , Liliya Lyandres , Peter J. Guest
Abstract: An electronic device may have input-output devices such as keyboard keys or other buttons. Components such as cameras and other devices may have trim structures. A housing may be used to form an enclosure for the components. Keyboard keys, trim structures, and/or other device structures such as housing structures may be provided with wear-resistant coatings. For example, a keyboard key may have a glyph such as an alphanumeric character formed from patterned layers of ink. To prevent wear to the key and glyph, the glyph may be coated with a wear-resistant coating. The wear-resistant coating may be formed from a polymer with embedded mineral particles such as aluminosilicate particles.
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公开(公告)号:US10691169B2
公开(公告)日:2020-06-23
申请号:US15975522
申请日:2018-05-09
Applicant: Apple Inc.
Inventor: Jeffrey C. Mylvaganam , Erik G. de Jong , Dale N. Memering , Xiao Bing Cai , Palaniappan Chinnakaruppan , Jong Kong Lee , Srikanth Kamireddi , Sawako Kamei , Feng Min , Jing Zhang , Xiang Du , Sai Feng Liu
IPC: G06F1/16 , G04B37/00 , B24B7/22 , G04B39/00 , B23K26/402 , H01Q1/24 , B28D5/00 , B24B29/00 , B24B37/04 , B24C11/00 , B23K26/364 , B05D1/02 , B24C1/08 , B23K103/00
Abstract: A cover for an electronic device and methods of forming a cover is disclosed. The electronic device may include a housing, and a cover coupled to the housing. The cover may have an inner surface having at least one of an intermediate polish and a final polish, a groove formed on the inner surface, and an outer surface positioned opposite the inner surface. The outer surface may have at least one of the intermediate polish and the final polish. The cover may also have a rounded perimeter portion formed between the inner surface and the outer surface. The rounded perimeter portion may be positioned adjacent the groove. The method for forming the cover may include performing a first polishing process on the sapphire component using a polishing tool, and performing a second polishing process on the groove of the sapphire component forming the cover using blasting media.
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公开(公告)号:US20180284843A1
公开(公告)日:2018-10-04
申请号:US15975522
申请日:2018-05-09
Applicant: Apple Inc.
Inventor: Jeffrey C. Mylvaganam , Erik G. de Jong , Dele N. Memering , Xiao Bing Cai , Palaniappan Chinnakaruppan , Jong Kong Lee , Srikanth Kamireddi , Sawako Kamei , Feng Min , Jing Zhang , Xiang Du , Sai Feng Liu
IPC: G06F1/16 , B24B37/04 , B05D1/02 , B23K26/402 , G04B39/00 , G04B37/00 , B24C11/00 , B24C1/08 , B23K26/364 , B24B29/00 , B24B7/22 , B23K103/00 , H01Q1/24
Abstract: A cover for an electronic device and methods of forming a cover is disclosed. The electronic device may include a housing, and a cover coupled to the housing. The cover may have an inner surface having at least one of an intermediate polish and a final polish, a groove formed on the inner surface, and an outer surface positioned opposite the inner surface. The outer surface may have at least one of the intermediate polish and the final polish. The cover may also have a rounded perimeter portion formed between the inner surface and the outer surface. The rounded perimeter portion may be positioned adjacent the groove. The method for forming the cover may include performing a first polishing process on the sapphire component using a polishing tool, and performing a second polishing process on the groove of the sapphire component forming the cover using blasting media.
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公开(公告)号:US09710023B2
公开(公告)日:2017-07-18
申请号:US14834315
申请日:2015-08-24
Applicant: Apple Inc.
Inventor: Ming Kun Shi , Jason O. Mettler , Hilbert T. Kwan , Christopher Bruni , Qi Tian , Jing Zhang , Howard E. Bujtor , Stephen V. Jayanathan , Houtan R. Farahani
IPC: G06F1/16
CPC classification number: G06F1/1656 , G06F1/1688
Abstract: Perforated structures and methods for forming perforated structures are disclosed. The perforated structures include partial holes or blind-holes that pass partially through the substrate. The partial holes can be positioned proximate to through-holes that pass entirely through the substrate. The partial holes add mechanical strength to the perforated substrate. Described are methods for modifying the optical appearance of the partial holes such that the partial holes appear indistinguishable from the through-holes, which allows for flexibility in designing cosmetically appealing patterns within the perforated structures.
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公开(公告)号:US20160202732A1
公开(公告)日:2016-07-14
申请号:US14834315
申请日:2015-08-24
Applicant: Apple Inc.
Inventor: Ming Kun Shi , Jason O. Mettler , Hilbert T. Kwan , Christopher Bruni , Qi Tian , Jing Zhang , Howard E. Bujtor , Stephen V. Jayanathan , Houtan R. Farahani
CPC classification number: G06F1/1656 , G06F1/1688
Abstract: Perforated structures and methods for forming perforated structures are disclosed. The perforated structures include partial holes or blind-holes that pass partially through the substrate. The partial holes can be positioned proximate to through-holes that pass entirely through the substrate. The partial holes add mechanical strength to the perforated substrate. Described are methods for modifying the optical appearance of the partial holes such that the partial holes appear indistinguishable from the through-holes, which allows for flexibility in designing cosmetically appealing patterns within the perforated structures.
Abstract translation: 公开了用于形成穿孔结构的穿孔结构和方法。 穿孔结构包括部分穿过基底的部分孔或盲孔。 部分孔可以靠近穿过基底的通孔定位。 部分孔向穿孔基材增加机械强度。 描述了用于改变部分孔的光学外观的方法,使得部分孔看起来与通孔不可区分,这允许在多孔结构内设计美观吸引人的图案的灵活性。
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公开(公告)号:US20160062405A1
公开(公告)日:2016-03-03
申请号:US14836943
申请日:2015-08-26
Applicant: Apple Inc.
Inventor: Jeffrey C. Mylvaganam , Erik G. de Jong , Dale N. Memering , Xiao Bing Cai , Palaniappan Chinnakaruppan , Jong Kong Lee , Srikanth Kamireddi , Sawako Kamei , Feng Min , Jing Zhang , Xiang Du , Sai Feng Liu
IPC: G06F1/16 , B23K26/402 , B23K26/364 , B05D1/02 , B24C1/08
CPC classification number: G06F1/1637 , B05D1/02 , B23K26/364 , B23K26/402 , B23K2103/50 , B23K2103/54 , B24B7/228 , B24B29/005 , B24B37/04 , B24C1/08 , B24C11/00 , G04B37/0008 , G04B39/006 , G06F1/163 , H01Q1/243
Abstract: A cover for an electronic device and methods of forming a cover is disclosed. The electronic device may include a housing, and a cover coupled to the housing. The cover may have an inner surface having at least one of an intermediate polish and a final polish, a groove formed on the inner surface, and an outer surface positioned opposite the inner surface. The outer surface may have at least one of the intermediate polish and the final polish. The cover may also have a rounded perimeter portion formed between the inner surface and the outer surface. The rounded perimeter portion may be positioned adjacent the groove. The method for forming the cover may include performing a first polishing process on the sapphire component using a polishing tool, and performing a second polishing process on the groove of the sapphire component forming the cover using blasting media.
Abstract translation: 公开了一种用于电子设备的盖和形成盖的方法。 电子设备可以包括壳体和联接到壳体的盖。 盖可以具有内表面,其具有中间抛光剂和最终抛光剂中的至少一种,形成在内表面上的凹槽和与内表面相对定位的外表面。 外表面可以具有中间抛光剂和最终抛光剂中的至少一种。 盖子还可以具有形成在内表面和外表面之间的圆形周边部分。 圆形的周边部分可以邻近凹槽定位。 用于形成盖的方法可以包括使用抛光工具对蓝宝石部件进行第一抛光处理,并且使用喷砂介质对形成盖的蓝宝石部件的凹槽进行第二抛光处理。
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