TREATMENT OF SUBSTRATE SUB-SURFACE
    2.
    发明申请
    TREATMENT OF SUBSTRATE SUB-SURFACE 有权
    基层表面处理

    公开(公告)号:US20160202732A1

    公开(公告)日:2016-07-14

    申请号:US14834315

    申请日:2015-08-24

    Applicant: Apple Inc.

    CPC classification number: G06F1/1656 G06F1/1688

    Abstract: Perforated structures and methods for forming perforated structures are disclosed. The perforated structures include partial holes or blind-holes that pass partially through the substrate. The partial holes can be positioned proximate to through-holes that pass entirely through the substrate. The partial holes add mechanical strength to the perforated substrate. Described are methods for modifying the optical appearance of the partial holes such that the partial holes appear indistinguishable from the through-holes, which allows for flexibility in designing cosmetically appealing patterns within the perforated structures.

    Abstract translation: 公开了用于形成穿孔结构的穿孔结构和方法。 穿孔结构包括部分穿过基底的部分孔或盲孔。 部分孔可以靠近穿过基底的通孔定位。 部分孔向穿孔基材增加机械强度。 描述了用于改变部分孔的光学外观的方法,使得部分孔看起来与通孔不可区分,这允许在多孔结构内设计美观吸引人的图案的灵活性。

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