发明申请
- 专利标题： METHOD OF FORMING ASPER-SILVER ON A LEAD FRAME
- 专利标题（中）： 在铅框架上形成平板银的方法
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申请号： US14592548申请日： 2015-01-08
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公开(公告)号： US20160204003A1公开(公告)日： 2016-07-14
- 发明人: Yiu Fai KWAN , Yu Lung LAM , Chun Ho YAU , Wing Lam AU
- 申请人： Yiu Fai KWAN , Yu Lung LAM , Chun Ho YAU , Wing Lam AU
- 主分类号： H01L21/48
- IPC分类号： H01L21/48 ; C25D3/46 ; C25D5/02 ; C23C18/31 ; C25D5/18 ; C25D7/12 ; C23C28/02 ; H01L21/288 ; C25D5/10
摘要：
A method for plating a lead frame comprises the steps of plating the lead frame with at least one plating layer including silver and forming an asper-silver layer comprising nano-silver formations over the at least one plating layer including silver. The asper-silver layer is particularly beneficial for enhancing the adhesion of plastic molding compound to the lead frame.
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