Invention Application
US20160212872A1 Insert Molding Around Glass Members for Portable Electronic Devices
审中-公开
在便携式电子设备玻璃部件周围插入成型
- Patent Title: Insert Molding Around Glass Members for Portable Electronic Devices
- Patent Title (中): 在便携式电子设备玻璃部件周围插入成型
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Application No.: US14993058Application Date: 2016-01-11
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Publication No.: US20160212872A1Publication Date: 2016-07-21
- Inventor: David Pakula , Stephen Brian Lynch , Richard Hung Minh Dinh , Tang Yew Tan , Lee Hua Tan
- Applicant: Apple Inc.
- Main IPC: H05K5/03
- IPC: H05K5/03 ; G06F3/041 ; A45F5/00 ; H05K5/00 ; A45C11/00
Abstract:
An electronic device having an enclosure formed from at least one glass cover and a peripheral structure formed adjacent the periphery of the glass cover is disclosed. The peripheral structure can be secured adjacent to the glass cover with an adhesive. The peripheral structure can be molded adjacent the glass cover so that a gapless interface is formed between the peripheral structure and the periphery of the glass cover. In one embodiment, the peripheral structure includes at least an inner peripheral structure and an outer peripheral structure.
Public/Granted literature
- US09992891B2 Insert molding around glass members for portable electronic devices Public/Granted day:2018-06-05
Information query
