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公开(公告)号：US20210274671A1
公开(公告)日：2021-09-02
申请号：US17325639
申请日：2021-05-20
Applicant: Apple Inc.
Inventor： David Pakula , Stephen Brian Lynch , Richard Hung Minh Dinh , Tang Yew Tan , Lee Hua Tan
Abstract: An electronic device having an enclosure formed from at least one glass cover and a peripheral structure formed adjacent the periphery of the glass cover is disclosed. The peripheral structure can be secured adjacent to the glass cover with an adhesive. The peripheral structure can be molded adjacent the glass cover so that a gapless interface is formed between the peripheral structure and the periphery of the glass cover. In one embodiment, the peripheral structure includes at least an inner peripheral structure and an outer peripheral structure.
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公开(公告)号：US12302521B2
公开(公告)日：2025-05-13
申请号：US18211086
申请日：2023-06-16
Applicant: Apple Inc.
Inventor： David Pakula , Stephen Brian Lynch , Richard Hung Minh Dinh , Tang Yew Tan , Lee Hua Tan
Abstract: An electronic device having an enclosure formed from at least one glass cover and a peripheral structure formed adjacent the periphery of the glass cover is disclosed. The peripheral structure can be secured adjacent to the glass cover with an adhesive. The peripheral structure can be molded adjacent the glass cover so that a gapless interface is formed between the peripheral structure and the periphery of the glass cover. In one embodiment, the peripheral structure includes at least an inner peripheral structure and an outer peripheral structure.
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公开(公告)号：US20230337384A1
公开(公告)日：2023-10-19
申请号：US18211086
申请日：2023-06-16
Applicant: Apple Inc.
Inventor： David Pakula , Stephen Brian Lynch , Richard Hung Minh Dinh , Tang Yew Tan , Lee Hua Tan
CPC classification number: H05K5/03 , H04M1/0266 , H04M1/0249 , G06F1/1626 , G06F1/1656 , A45C11/00 , A45F5/00 , G06F3/041 , H05K5/0017
Abstract: An electronic device having an enclosure formed from at least one glass cover and a peripheral structure formed adjacent the periphery of the glass cover is disclosed. The peripheral structure can be secured adjacent to the glass cover with an adhesive. The peripheral structure can be molded adjacent the glass cover so that a gapless interface is formed between the peripheral structure and the periphery of the glass cover. In one embodiment, the peripheral structure includes at least an inner peripheral structure and an outer peripheral structure.
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公开(公告)号：US09992891B2
公开(公告)日：2018-06-05
申请号：US14993058
申请日：2016-01-11
Applicant: Apple Inc.
Inventor： David Pakula , Stephen Brian Lynch , Richard Hung Minh Dinh , Tang Yew Tan , Lee Hua Tan
IPC: H05K5/02 , H04M1/03 , H05K5/03 , H04M1/02 , G06F1/16 , A45C11/00 , A45F5/00 , G06F3/041 , H05K5/00
CPC classification number: H05K5/03 , A45C11/00 , A45F5/00 , G06F1/1626 , G06F1/1656 , G06F3/041 , H04M1/0249 , H04M1/0266 , H05K5/0017
Abstract: An electronic device having an enclosure formed from at least one glass cover and a peripheral structure formed adjacent the periphery of the glass cover is disclosed. The peripheral structure can be secured adjacent to the glass cover with an adhesive. The peripheral structure can be molded adjacent the glass cover so that a gapless interface is formed between the peripheral structure and the periphery of the glass cover. In one embodiment, the peripheral structure includes at least an inner peripheral structure and an outer peripheral structure.
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5.发明申请公开(公告)号：US20160212872A1
公开(公告)日：2016-07-21
申请号：US14993058
申请日：2016-01-11
Applicant: Apple Inc.
Inventor： David Pakula , Stephen Brian Lynch , Richard Hung Minh Dinh , Tang Yew Tan , Lee Hua Tan
CPC classification number: H05K5/03 , A45C11/00 , A45F5/00 , G06F1/1626 , G06F1/1656 , G06F3/041 , H04M1/0249 , H04M1/0266 , H05K5/0017
Abstract: An electronic device having an enclosure formed from at least one glass cover and a peripheral structure formed adjacent the periphery of the glass cover is disclosed. The peripheral structure can be secured adjacent to the glass cover with an adhesive. The peripheral structure can be molded adjacent the glass cover so that a gapless interface is formed between the peripheral structure and the periphery of the glass cover. In one embodiment, the peripheral structure includes at least an inner peripheral structure and an outer peripheral structure.
Abstract translation: 公开了一种电子设备，其具有由至少一个玻璃盖和邻近玻璃盖周边形成的外围结构形成的外壳。 周边结构可以用粘合剂固定在玻璃盖附近。 外围结构可以在玻璃盖附近模制，从而在外围结构和玻璃罩周边之间形成无间隙的界面。 在一个实施例中，外围结构至少包括内周结构和外周结构。
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Patent Agency Ranking
公开(公告)号：US11019744B2
公开(公告)日：2021-05-25
申请号：US16740793
申请日：2020-01-13
Applicant: Apple Inc.
Inventor： David Pakula , Stephen Brian Lynch , Richard Hung Minh Dinh , Tang Yew Tan , Lee Hua Tan
Abstract: An electronic device having an enclosure formed from at least one glass cover and a peripheral structure formed adjacent the periphery of the glass cover is disclosed. The peripheral structure can be secured adjacent to the glass cover with an adhesive. The peripheral structure can be molded adjacent the glass cover so that a gapless interface is formed between the peripheral structure and the periphery of the glass cover. In one embodiment, the peripheral structure includes at least an inner peripheral structure and an outer peripheral structure.
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公开(公告)号：US20200154586A1
公开(公告)日：2020-05-14
申请号：US16740793
申请日：2020-01-13
Applicant: Apple Inc.
Inventor： David Pakula , Stephen Brian Lynch , Richard Hung Minh Dinh , Tang Yew Tan , Lee Hua Tan
Abstract: An electronic device having an enclosure formed from at least one glass cover and a peripheral structure formed adjacent the periphery of the glass cover is disclosed. The peripheral structure can be secured adjacent to the glass cover with an adhesive. The peripheral structure can be molded adjacent the glass cover so that a gapless interface is formed between the peripheral structure and the periphery of the glass cover. In one embodiment, the peripheral structure includes at least an inner peripheral structure and an outer peripheral structure.
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公开(公告)号：US10575421B2
公开(公告)日：2020-02-25
申请号：US15989133
申请日：2018-05-24
Applicant: Apple Inc.
Inventor： David Pakula , Stephen Brian Lynch , Richard Hung Minh Dinh , Tang Yew Tan , Lee Hua Tan
Abstract: An electronic device having an enclosure formed from at least one glass cover and a peripheral structure formed adjacent the periphery of the glass cover is disclosed. The peripheral structure can be secured adjacent to the glass cover with an adhesive. The peripheral structure can be molded adjacent the glass cover so that a gapless interface is formed between the peripheral structure and the periphery of the glass cover. In one embodiment, the peripheral structure includes at least an inner peripheral structure and an outer peripheral structure.
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公开(公告)号：US20180270976A1
公开(公告)日：2018-09-20
申请号：US15989133
申请日：2018-05-24
Applicant: Apple Inc.
Inventor： David Pakula , Stephen Brian Lynch , Richard Hung Minh Dinh , Tang Yew Tan , Lee Hua Tan
CPC classification number: H05K5/03 , A45C11/00 , A45F5/00 , G06F1/1626 , G06F1/1656 , G06F3/041 , H04M1/0249 , H04M1/0266 , H05K5/0017
Abstract: An electronic device having an enclosure formed from at least one glass cover and a peripheral structure formed adjacent the periphery of the glass cover is disclosed. The peripheral structure can be secured adjacent to the glass cover with an adhesive. The peripheral structure can be molded adjacent the glass cover so that a gapless interface is formed between the peripheral structure and the periphery of the glass cover. In one embodiment, the peripheral structure includes at least an inner peripheral structure and an outer peripheral structure.
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公开(公告)号：US11723165B2
公开(公告)日：2023-08-08
申请号：US17325639
申请日：2021-05-20
Applicant: Apple Inc.
Inventor： David Pakula , Stephen Brian Lynch , Richard Hung Minh Dinh , Tang Yew Tan , Lee Hua Tan
CPC classification number: H05K5/03 , A45C11/00 , A45F5/00 , G06F1/1626 , G06F1/1656 , G06F3/041 , H04M1/0249 , H04M1/0266 , H05K5/0017
Abstract: An electronic device having an enclosure formed from at least one glass cover and a peripheral structure formed adjacent the periphery of the glass cover is disclosed. The peripheral structure can be secured adjacent to the glass cover with an adhesive. The peripheral structure can be molded adjacent the glass cover so that a gapless interface is formed between the peripheral structure and the periphery of the glass cover. In one embodiment, the peripheral structure includes at least an inner peripheral structure and an outer peripheral structure.
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