发明申请
- 专利标题: LOW DENSITY POLISHING PAD
- 专利标题(中): 低密度抛光垫
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申请号: US14611064申请日: 2015-01-30
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公开(公告)号: US20160221145A1公开(公告)日: 2016-08-04
- 发明人: Ping Huang , William C. Allison , Richard Frentzel , Paul Andre Lefevre , Robert Kerprich , Diane Scott
- 申请人: Ping Huang , William C. Allison , Richard Frentzel , Paul Andre Lefevre , Robert Kerprich , Diane Scott
- 主分类号: B24B37/24
- IPC分类号: B24B37/24 ; C08J9/00 ; C08J9/228
摘要:
Low density polishing pads and methods of fabricating low density polishing pads are described. In an example, a polishing pad for polishing a substrate includes a polishing body having a density approximately in the range of 0.4-0.55 g/cc. The polishing body includes a thermoset polyurethane material and a plurality of closed cell pores dispersed in the thermoset polyurethane material. Each of the plurality of closed cell pores has a shell composed of an acrylic co-polymer.
公开/授权文献
- US10946495B2 Low density polishing pad 公开/授权日:2021-03-16