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    CMP pad with local area transparency
    6.
    发明申请
    CMP pad with local area transparency 有权
    具有局部透明度的CMP垫

    公开(公告)号：US20110171883A1

    公开(公告)日：2011-07-14

    申请号：US12657135

    申请日：2010-01-13

    申请人： William Allison ,  Ping Huang ,  Diane Scott ,  Richard Frentzel ,  Robert Kerprich

    发明人： William Allison ,  Ping Huang ,  Diane Scott ,  Richard Frentzel ,  Robert Kerprich

    IPC分类号： B24D7/12 ,  B24B49/12 ,  B24D3/00 ,  B24D3/32 ,  B24D11/00

    CPC分类号： B24B37/205

    摘要： A CMP polishing pad comprising (a) a polishing layer having a polishing surface and a back surface opposite said polishing surface; said polishing layer having at least one cured opaque thermoset polyurethane region and at least one aperture region; said at least one cured opaque thermoset region has a porosity from about 10% to about 55% by volume; said at least one aperture region having (1) a top opening positioned below the polishing surface, (2) a bottom opening that is co-planar with said back surface and (3) straight line vertical sidewalls extending from said aperture top opening to said aperture bottom opening; said at least one aperture region filled with a cured plug of thermoset polyurethane local area transparency material that has a light transmission of less than 80% at a wavelength from 700 to 710 nanometers and is chemically bonded directly to a thermoset polyurethane opaque area; (b) an aperture-free removable release sheet covering at least a portion of said back surface of the polishing layer; and (c) an adhesive layer interposed between said polishing layer and said release sheet; said adhesive layer capable of adhering the polishing layer to a platen of a CMP apparatus after said release sheet has been removed.

    摘要翻译： 一种CMP抛光垫，包括（a）具有抛光表面和与所述抛光表面相对的后表面的抛光层; 所述抛光层具有至少一个固化的不透明热固性聚氨酯区域和至少一个开口区域; 所述至少一个固化的不透明热固性区域具有约10体积％至约55体积％的孔隙率; 所述至少一个开口区域具有（1）位于抛光表面下方的顶部开口，（2）与所述后表面共面的底部开口和（3）从所述开口顶部开口延伸到所述开口顶部开口的直线垂直侧壁 孔底开口; 所述至少一个孔区填充有热固性聚氨酯局部透明材料的固化塞，其在700至710纳米的波长下具有小于80％的透光率，并且直接化学键合到热固性聚氨酯不透明区域; （b）覆盖所述抛光层的所述后表面的至少一部分的无孔可移除的剥离片; 和（c）介于所述抛光层和所述剥离片之间的粘合剂层; 所述粘合剂层能够在去除所述剥离片之后将抛光层粘附到CMP设备的压板上。